Over-molded Probe Housing for Waterproofing
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Solution Overview
Problem
Existing water temperature profile probes are prone to leakage and failure due to expensive and complex housing designs that allow water penetration, leading to costly manufacturing and maintenance issues.
Innovation Solution
A probe with a housing over-molded using low-pressure injection molding to seal electronic components, preventing water exposure and damage, featuring a pressure sensor for depth measurement, a temperature sensor for temperature measurement, and a communication interface for data output, with a power supply integrated within the housing for self-sufficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If traditional housing designs with threaded connections, gaskets, and seals are used to allow access to electronic components, then ease of repair and component replacement is improved, but reliability deteriorates due to leakage and water penetration
Solution Approach 1:
The probe is divided into modular electronic components (pressure sensor, temperature sensor, microcontroller, memory, communication interface) that are independently housed within sealed compartments, allowing individual component replacement without compromising overall waterproofing
Solution Approach 2:
A hermetic seal acts as an intermediary barrier between the electronic components and the external water environment, providing reliable waterproofing while still allowing for controlled access during manufacturing and maintenance
2Ease of operation
If complex housing designs with multiple seals and threaded connections are used to provide access to components, then ease of operation is improved, but device complexity increases leading to manufacturing costs and assembly complexity
Solution Approach 1:
The complexity of multiple seals, threaded connections, and access mechanisms is extracted and replaced with a single integrated hermetic seal design, simplifying the housing structure while maintaining component accessibility through controlled interfaces
Solution Approach 2:
The simplified housing design serves multiple functions: it provides structural support, ensures waterproofing through hermetic sealing, and allows for component access during manufacturing and maintenance, eliminating the need for separate complex access mechanisms
3Reliability
If traditional sealed housing designs are used to prevent water penetration, then reliability is improved, but manufacturing cost increases due to expensive seals, gaskets, and precision threading
Solution Approach 1:
The probe employs a cost-effective hermetic sealing approach that provides reliable waterproofing without requiring expensive reusable seals and gaskets, accepting that the sealing structure may be optimized for the product lifecycle rather than indefinite reuse
Solution Approach 2:
Traditional mechanical sealing methods (threaded connections, gaskets, O-rings) are replaced with a hermetic seal design that achieves superior waterproofing through a more straightforward manufacturing process, reducing both material and assembly costs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The probe effectively measures water temperature profiles without the need for replaceable components, ensuring reliability and longevity by sealingly enclosing the electronic assembly, resisting water penetration up to 300 ft in seawater, and providing accurate depth and temperature data through a user-friendly interface.
Implementation Method 1
a pressure sensor to measure a depth value indicative of a water depth
Implementation Method 2
a temperature sensor to measure a water temperature value indicative of a water temperature
Implementation Method 3
the housing over-molded upon external surfaces of the controller and power supply to sealingly enclose the controller and the power supply
Data Source
AI summary
A probe for measurement of water temperature profiles is disclosed herein. In various aspects, the probe may include an electronic assembly and a housing over-molded upon at least portions of the electronic assembly to sealingly enclose the portions of the electronic assembly. The electronic assembly may include a pressure sensor to measure a pressure value indicative of a water depth, and a temperature sensor to measure a water temperature value indicative of a water temperature, a communication interface. Methods of manufacture of the probe are also disclosed herein.


