Overmolded Sensor Mount Assembly for Fast Inverter Housing Retention

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Solution Overview

Problem

Existing sensor mount assemblies for power inverters in vehicles are complex and time-consuming to assemble/disassemble, leading to high repair costs due to numerous individual parts and cumbersome mounting processes.

Innovation Solution

A simplified sensor mount assembly featuring a busbar with an overmolded main body and radially extending backing surface, along with axially extending fingers, which are mechanically deformed to facilitate easy attachment to a housing, allowing for snap-fit engagement and secure retention.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If conventional mounting methods using wires, retaining clamps, and fasteners are used, then sensors can be mounted on the power inverter chassis, but assembly and disassembly become time-consuming and repair costs increase

Engineering Contradiction:
Improvesensor mounting easeVSAvoidassembly time
Core Design Contradiction:
Ease of operationVSLoss of time

Solution Approach 1:

The patent combines multiple separate mounting components (busbar, retaining clamp, fasteners, wires) into a single integrated sensor mount assembly. The sensor housing is directly coupled to the busbar structure, eliminating the need for separate mounting operations and reducing assembly complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The busbar structure serves multiple functions simultaneously: it provides electrical connectivity, structural support, and sensor mounting capability. This multi-functional design eliminates the need for separate dedicated mounting hardware, reducing both assembly time and part count.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If numerous individual parts are used to mount sensors, then secure retention is achieved, but repair costs become relatively high

Engineering Contradiction:
Improvesensor retention securityVSAvoidrepair cost
Core Design Contradiction:
ReliabilityVSEase of repair

Solution Approach 1:

The sensor mount assembly merges the busbar, retaining structure, and mounting features into a single integrated component. This reduces the number of individual parts that need to be handled during repair operations, lowering labor costs and simplifying the repair process while maintaining secure sensor retention.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If conventional sensor mounting assemblies are used, then sensors can be secured to the chassis, but the assembly process becomes complex and expensive

Engineering Contradiction:
Improvesensor mounting securityVSAvoidmounting assembly complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent integrates the mounting assembly into a single unified structure where the sensor housing is directly coupled to the busbar. This eliminates the complexity of coordinating multiple separate components (clamps, fasteners, wires) and simplifies the overall mounting system while maintaining secure sensor attachment.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The busbar structure is designed to perform multiple functions: electrical conduction, mechanical support, and sensor mounting. This multi-functionality reduces the need for separate dedicated mounting components, simplifying the overall assembly while ensuring secure sensor retention.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces manufacturing costs and simplifies the assembly process, enabling easier retrofitting into existing power inverters and other components, while maintaining secure sensor positioning.

Implementation Method 1

The main body is overmolded onto the busbar

Methodology Applied
Scientific EffectOvermolding:

Implementation Method 2

axially extending fingers, which are mechanically deformed to facilitate easy attachment to a housing, allowing for snap-fit engagement

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS20100108836A1Sensor mount assemblies and sensor assemblies
Publication Date: 2010.05.06 GM GLOBAL TECHNOLOGY OPERATIONS LLC
  • US20100108836A1 patent drawing
  • US20100108836A1 patent drawing
  • US20100108836A1 patent drawing

AI summary

Sensor mount assemblies and sensor assemblies are provided. In an embodiment, by way of example only, a sensor mount assembly includes a busbar, a main body, a backing surface, and a first finger. The busbar has a first end and a second end. The main body is overmolded onto the busbar. The backing surface extends radially outwardly relative to the main body. The first finger extends axially from the backing surface, and the first finger has a first end, a second end, and a tooth. The first end of the first finger is disposed on the backing surface, and the tooth is formed on the second end of the first finger.