Oversized Receptacle Cavity for Finned and Un-finned Module Interoperability

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional receptacle assemblies are inadequate for handling both finned and un-finned pluggable modules due to size and shape compatibility issues, leading to limited interoperability in communication systems, which affects heat transfer and module reliability.

Innovation Solution

The design of a receptacle assembly with an oversized module cavity that can accommodate both finned and un-finned pluggable modules, featuring a communication connector that is selectively matable with both types, and incorporating either open airflow or heat spreading mechanisms to facilitate effective heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If the module cavity is designed to fit finned pluggable modules, then heat transfer efficiency is improved, but compatibility with un-finned modules is lost

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidmodule compatibility
Core Design Contradiction:
Loss of energyVSAdaptability or versatility

Solution Approach 1:

The module cavity is designed with an oversized configuration that can accommodate both finned and un-finned pluggable modules. The cavity dimensions exceed the maximum dimensions of finned modules, creating a universal receptacle that accepts multiple module types without requiring separate specialized cavities for each module variety.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The receptacle assembly incorporates different thermal management approaches in different regions: an open airflow cavity design for convective cooling and optional thermal transport elements for conductive heat transfer. This localized differentiation allows the same oversized cavity to effectively cool both finned modules (which benefit from airflow) and un-finned modules (which benefit from thermal transport contact).

Inventive Principle:
Principle #3Local quality

2Adaptability or versatility

If the module cavity is oversized to accommodate un-finned modules, then module compatibility is improved, but heat transfer efficiency deteriorates

Engineering Contradiction:
Improvemodule compatibilityVSAvoidheat transfer efficiency
Core Design Contradiction:
Adaptability or versatilityVSLoss of energy

Solution Approach 1:

The receptacle assembly incorporates different thermal management approaches in different regions: an open airflow cavity design for convective cooling and optional thermal transport elements for conductive heat transfer. This localized differentiation allows the same oversized cavity to effectively cool both finned modules (which benefit from airflow) and un-finned modules (which benefit from thermal transport contact).

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

Thermal transport elements act as intermediaries between the module and the heat dissipation system. These elements can be positioned to make thermal contact with un-finned modules in the oversized cavity, effectively bridging the gap between the module and the heat sink functionality, thereby maintaining heat transfer efficiency despite the increased cavity size.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of manufacture

If conventional receptacle assemblies are used, then manufacturing simplicity is maintained, but interoperability between different module types is limited

Engineering Contradiction:
Improvereceptacle assembly simplicityVSAvoidmodule interoperability
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The module cavity is designed with an oversized configuration that can accommodate both finned and un-finned pluggable modules. The cavity dimensions exceed the maximum dimensions of finned modules, creating a universal receptacle that accepts multiple module types without requiring separate specialized cavities for each module variety.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The receptacle assembly allows for configurable thermal management components, such as optional thermal transport elements that can be present or absent depending on the specific application requirements. This dynamic configurability enables the same basic receptacle structure to serve multiple interoperability needs while maintaining manufacturing simplicity through a standardized base design.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables interoperability between various pluggable modules and receptacle assemblies, enhancing heat transfer efficiency and system reliability by allowing both finned and un-finned modules to be used interchangeably, regardless of their thickness, thereby improving the flexibility and performance of communication systems.

Implementation Method 1

The heat spreading receptacle assembly has a thermal transport in the second module cavity at the top wall configured to dissipate heat

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

Air flowing through and around the receptacle assembly transfers the heat that emanates from the pluggable module

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS9389368B1Receptacle assembly and set of receptacle assemblies for a communication system
Publication Date: 2016.07.12 TE CONNECTIVITY SOLUTIONS GMBH
  • US9389368B1 patent drawing
  • US9389368B1 patent drawing
  • US9389368B1 patent drawing

AI summary

A receptacle assembly includes a receptacle housing having a module cavity with communication connector positioned in the receptacle housing. The module cavity is oversized to selectively receive a finned pluggable module having a plurality of heat transfer fins and is configured to selectively receive an un-finned pluggable module having a thickness dimension that is smaller than a thickness dimension of the finned pluggable module. The mating interface of the communication connector being selectively matable with both the finned pluggable module and the un-finned pluggable module. Locating features being configured to engage and locate both the finned pluggable module and the un-finned pluggable module depending on which of the finned pluggable module or the un-finned pluggable module is loaded into the module cavity.