OVJP Deposition Apertures Decoupling for Profile Uniformity
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Solution Overview
Problem
Conventional OLED fabrication techniques, such as OVJP, face challenges in achieving ideal deposition profiles with steep sidewalls and flat tops, which are crucial for maximizing display performance and extending the life of light-emitting devices, due to coupling effects between closely spaced deposition apertures.
Innovation Solution
The use of novel OVJP die designs with decoupled deposition apertures, where the delivery and exhaust apertures are separated by specific distances to prevent coupling, allowing for the creation of deposition profiles with sharp sidewalls and uniform thickness, optimizing the ratio of emitting to non-emitting areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If delivery and exhaust apertures are closely spaced to maximize emitting area, then productivity and display performance are improved, but coupling effects between apertures cause non-uniform deposition profiles with poor sidewall steepness
Solution Approach 1:
The patent divides the aperture system into separate delivery apertures and exhaust apertures, positioning them at different locations within the depositor. This segmentation allows the material flow paths to be distinct, preventing coupling effects between adjacent apertures while maintaining high emitting area ratios. The delivery apertures are positioned to maximize material delivery to emitting regions, while exhaust apertures are positioned to remove excess material without interfering with adjacent deposition zones.
Solution Approach 2:
The patent introduces an intermediary region or structure between delivery and exhaust apertures that mediates the material flow. This intermediary allows the system to achieve close spacing of apertures for high productivity while preventing direct coupling effects. The intermediary structure guides material flow from delivery to exhaust apertures in a controlled manner, ensuring uniform deposition profiles even when apertures are closely spaced.
2Manufacturing precision
If delivery and exhaust apertures are separated by specific distances to prevent coupling, then deposition profile quality is improved, but device complexity increases
Solution Approach 1:
The patent optimizes specific parameters of the aperture arrangement, such as the distance between delivery and exhaust apertures, the size of apertures, and their positioning relative to each other and to the substrate. By carefully selecting these parameters, the system achieves coupling-free deposition profiles without requiring overly complex structures. The parameter optimization allows for relatively simple aperture arrangements that maintain high deposition quality.
3Ease of manufacture
If conventional OVJP techniques are used with standard aperture designs, then ease of manufacture is maintained, but sidewall steepness and flat top uniformity are insufficient
Solution Approach 1:
The patent addresses the deposition profile shape by utilizing three-dimensional aperture arrangements and positioning apertures at different heights or angles. This dimensional approach allows for steep sidewalls and uniform flat tops without complicating the manufacturing process. The vertical or angular arrangement of apertures creates the desired profile shape while maintaining ease of fabrication using standard OVJP techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the brightness and longevity of OLED displays by ensuring uniform material deposition and minimizing the space between pixels, thereby improving the overall performance and lifespan of the devices.
Implementation Method 1
organic vapor jet printing (OVJP)... deposition profiles... uniform thickness
Data Source
AI summary
Devices suitable for use in OVJP and similar deposition techniques are provided that include multiple delivery apertures that are uncoupled from one another, allowing for more plateau-like deposition profiles. Fabrication techniques for such devices are also provided in which multiple wafers are etched and laminated to one another to form a monolithic depositor block.