OVJP Solder Joint Seal for High-Temperature Fluid Integrity
Solution Overview
Problem
Existing organic vapor jet printing (OVJP) systems face challenges in maintaining a fluid-tight seal at elevated temperatures due to limitations with polymer-based adhesives and metal fasteners, which can soften or degrade, and require additional high-temperature polymer-based gaskets or seals.
Innovation Solution
The use of a solder joint formed by depositing metals over opposing surfaces of OVJP device components, which are then pressed together to create a eutectic alloy, providing a durable and fluid-tight seal that eliminates the need for high-temperature adhesives and gaskets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If polymer-based adhesives or metal fasteners with gaskets are used to bond components, then assembly is straightforward, but the seal degrades at elevated temperatures causing fluid leakage
Solution Approach 1:
The patent changes the material parameter from polymer-based adhesive to metal solder, which has a fundamentally different temperature stability profile. The solder joint maintains its bonding and sealing properties at elevated temperatures where polymer adhesives would degrade, directly resolving the contradiction between seal integrity and operating temperature.
Solution Approach 2:
The patent replaces the mechanical fastening system (metal fasteners with gaskets) with a metallurgical bonding system (solder joint). This substitution eliminates the need for separate gaskets and fasteners, creating an integrated seal that is inherently resistant to thermal degradation, thus improving reliability at high temperatures.
2Reliability
If high-temperature polymer-based gaskets or seals are used with metal fasteners, then fluid-tight sealing is achieved, but additional components increase device complexity
Solution Approach 1:
The patent merges the functions of the fastener and the seal into a single integrated solder joint. The solder joint simultaneously provides both the mechanical bonding function of a fastener and the fluid-tight sealing function of a gasket, eliminating the need for separate components and reducing overall device complexity while maintaining reliability.
Solution Approach 2:
The solder joint performs multiple functions simultaneously: it provides mechanical bonding between components, creates a fluid-tight seal, and withstands elevated temperatures. This multi-functionality replaces what would otherwise require separate dedicated components for each function, reducing device complexity.
3Ease of manufacture
If polymer-based adhesives are used for bonding, then assembly is simple, but the adhesive softens or degrades at elevated temperatures
Solution Approach 1:
The patent changes the material parameter from polymer-based adhesive to metal solder, fundamentally altering the thermal performance characteristics. The solder maintains its bonding strength and structural integrity at elevated temperatures where polymer adhesives would soften or degrade, improving reliability without significantly complicating the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solder joint ensures long-term fluid-tight performance at elevated temperatures, enhancing the reliability and durability of OVJP systems by preventing fluid leakage and reducing the need for high-temperature materials.
Implementation Method 1
a solder joint located between the first and second surfaces. The solder joint circumscribes the fluid flow ports to form a fluid-tight seal between the plates
Implementation Method 2
depositing a metal layer over a surface of at least one of the plates
Data Source
AI summary
A solder joint may be used to attach components of an organic vapor jet printing device together with a fluid-tight seal that is capable of performance at high temperatures. The solder joint includes one or more metals that are deposited over opposing component surfaces, such as an inlet side of a nozzle plate and/or an outlet side of a mounting plate. The components are pressed together to form the solder joint. Two or more of the deposited metals may be capable of together forming a eutectic alloy, and the solder joint may be formed by heating the deposited metals to a temperature above the melting point of the eutectic alloy. A diffusion barrier layer and an adhesion layer may be included between the solder joint and each of the components.