Oxazine Compound with Triple Bonds for Thermal Stability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current benzoxazine compounds used in electronic materials lack sufficient thermal decomposition resistance and dielectric properties, particularly due to the generation of aniline-derived decomposed gases during ring-opening, which limits their long-term thermal durability.
Innovation Solution
An oxazine compound with an aromatic ring structure and multiple carbon-carbon triple bond structures is developed, incorporating specific functional groups to enhance thermal decomposition resistance and dielectric properties, forming a dense crosslinked structure upon curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If benzoxazine is prepared from aniline and phenol compounds, then the compound can undergo ring-opening polymerization by heating, but aniline-derived decomposed gases are generated reducing thermal decomposition resistance
Solution Approach 1:
The patent changes the chemical composition parameters by replacing aniline with aromatic diamines having specific structures (Formulae 1-3), which fundamentally alters the decomposition behavior. This parameter change eliminates the generation of aniline-derived decomposed gases while maintaining the ring-opening polymerization capability and heat resistance of benzoxazine compounds.
Solution Approach 2:
The patent creates composite molecular structures by combining aromatic diamine components with specific phenol compounds and formaldehyde. These composite structures (Formulae 4-6) integrate multiple functional groups including carbon-carbon triple bonds that enhance both heat resistance and thermal decomposition resistance simultaneously, resolving the contradiction between these two properties.
2Temperature
If conventional benzoxazine compounds are used, then they exhibit high heat resistance through strong hydrogen bonding, but they lack sufficient dielectric properties and show high moisture absorptivity
Solution Approach 1:
The patent introduces carbon-carbon triple bond structures and specific aromatic ring configurations into the benzoxazine molecular structure. These structural parameter changes reduce the polarity and hydrogen bonding density compared to conventional benzoxazines, thereby improving dielectric properties and reducing moisture absorptivity while preserving heat resistance through the aromatic backbone structure.
Solution Approach 2:
The patent applies local structural modifications by introducing specific functional groups (carbon-carbon triple bonds, aromatic diamine moieties) at strategic positions within the molecular structure. These localized quality changes affect specific properties (dielectric constant, moisture absorption) without compromising the overall heat resistance provided by the benzoxazine core structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The oxazine compound exhibits improved thermal decomposition resistance, dielectric properties, and low hygroscopicity, making it suitable for high-heat applications such as semiconductor sealing materials, circuit boards, and fiber-reinforced resins with enhanced thermal stability.
Implementation Method 1
undergoes ring-opening polymerization by heating by itself
Implementation Method 2
exhibits high heat resistance and low linear expansion due to a strong hydrogen bonding structure formed in a crosslinked structure
Data Source
AI summary
The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having the layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.