Oxazine Compound Triple Bonds Thermal Stability
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Solution Overview
Problem
Current benzoxazine compounds used in electronic materials lack sufficient thermal decomposition resistance and exhibit high linear expansion, limiting their long-term thermal durability and dielectric properties.
Innovation Solution
An oxazine compound with a structure featuring multiple carbon-carbon triple bond structures and aromatic ring structures is developed, which upon curing forms a dense crosslinked structure, enhancing thermal decomposition resistance and maintaining low thermal expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional benzoxazine compounds are used, then the material can be processed and cured, but the thermal decomposition resistance is insufficient and long-term thermal durability is poor
Solution Approach 1:
The patent changes the chemical structure parameters of the benzoxazine compound by introducing specific functional groups (carboxyl, hydroxyl, amine, or isocyanate groups) on the aromatic rings. This structural modification raises the thermal decomposition temperature from conventional levels to above 350°C, directly improving thermal decomposition resistance and enabling long-term thermal durability
Solution Approach 2:
The patent creates a composite molecular structure combining the benzoxazine core with additional functional groups (carboxyl, hydroxyl, amine, or isocyanate) attached to aromatic rings. This composite structure achieves synergistic effects where the functional groups enhance thermal stability while the benzoxazine framework maintains structural integrity, resulting in both improved thermal decomposition resistance and long-term durability
2Stability of the object's composition
If conventional benzoxazine compounds are used, then the material exhibits crosslinked structure, but the linear expansion coefficient is high
Solution Approach 1:
The patent introduces functional groups at specific positions on the aromatic rings (ortho, meta, or para positions) to create local structural features that restrict thermal expansion. These locally modified regions with carboxyl, hydroxyl, amine, or isocyanate groups form targeted interactions that reduce the overall linear expansion coefficient while preserving the crosslinked network structure
3Ease of manufacture
If conventional benzoxazine compounds are used, then the material can be prepared from phenol and amine, but the dielectric properties are insufficient
Solution Approach 1:
The patent modifies the chemical parameters of the benzoxazine compound by incorporating aromatic rings with specific functional groups (carboxyl, hydroxyl, amine, or isocyanate). This structural parameter change reduces moisture absorptivity and optimizes dielectric constant and loss tangent, achieving excellent dielectric properties while maintaining ease of preparation from phenol and amine components
4Stability of the object's composition
If conventional benzoxazine compounds are used, then the material exhibits hydrogen bonding structure, but the moisture absorptivity is high
Solution Approach 1:
The patent converts the potential harm of high moisture absorptivity into a benefit by strategically placing hydrophobic aromatic rings with specific functional groups. These groups participate in hydrogen bonding to maintain structural stability while the aromatic framework provides hydrophobic character that reduces moisture absorptivity, effectively converting the moisture vulnerability into a design feature
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The oxazine compound achieves improved thermal decomposition resistance, dielectric properties, and low hygroscopicity, making it suitable for high-heat applications such as semiconductor sealing materials and circuit boards.
Implementation Method 1
undergoes ring-opening polymerization by heating by itself
Implementation Method 2
exhibits high heat resistance and low linear expansion due to a strong hydrogen bonding structure formed in a crosslinked structure
Data Source
AI summary
The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.