Oxidation-Resistant Metal Particles for Semiconductor Substrates
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Solution Overview
Problem
The oxidation of copper layers on semiconductor chips impedes subsequent manufacturing processes such as die bonding, wire bonding, and molding, increasing the cost and complexity of semiconductor device packaging.
Innovation Solution
Depositing metal particles with a core of copper or aluminum and a highly oxidation-resistant shell, such as silver or gold, onto semiconductor substrates to form metal layers that protect against corrosion and enable electrical contact while allowing for wire bonding and molding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper layers are deposited on semiconductor chips to allow electrical access, then electrical conductivity is improved, but oxidation occurs which impedes subsequent manufacturing processes
Solution Approach 1:
The patent applies composite materials by creating a multi-layer metal structure consisting of a copper core layer providing electrical conductivity and an outer shell layer of oxidation-resistant material (such as nickel, palladium, or platinum) protecting against oxidation. This composite structure simultaneously achieves reliable electrical conductivity while preventing oxidation that would impede subsequent manufacturing processes like die bonding, wire bonding, and molding.
Solution Approach 2:
The oxidation-resistant shell layer acts as an intermediary between the copper core and the external environment. This intermediate layer protects the copper from direct contact with oxidizing agents while allowing the electrical function to pass through, thereby enabling subsequent manufacturing processes without interference from oxidation.
2Ease of operation
If copper layers are deposited to enable electrical contact, then electrical access is improved, but oxidation increases manufacturing cost and complexity
Solution Approach 1:
By using composite metal layers with an oxidation-resistant outer shell, the patent eliminates the need for additional protective measures or process modifications that would otherwise be required to prevent copper oxidation. This reduces packaging complexity while maintaining ease of electrical access.
Solution Approach 2:
The oxidation-resistant shell provides self-protection for the copper layer, automatically preventing oxidation without requiring external protective measures or complex packaging processes. This self-service approach simplifies the overall manufacturing process and reduces complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The oxidation-resistant metal layers prevent corrosion of the underlying copper or aluminum, ensuring reliable electrical and thermal conductivity, reducing contact resistance, and facilitating efficient packaging of semiconductor chips.
Implementation Method 1
Depositing metal particles with a core of copper or aluminum and a highly oxidation-resistant shell, such as silver or gold, onto semiconductor substrates to form metal layers
Implementation Method 2
The shells are made of a second metal material that is highly resistant to oxidation
Implementation Method 3
ensuring reliable electrical and thermal conductivity, reducing contact resistance
Implementation Method 4
ensuring reliable electrical and thermal conductivity
Data Source
AI summary
A method produces a metal layer on a semiconductor substrate. A metal layer is produced on the semiconductor substrate by depositing metal particles. The metal particles include cores made of a first metal material and shells surrounding the cores. The shells are made of a second metal material that is resistant to oxidation.