Oxide Bead Substrate Patterning via Selective Cohesion
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Solution Overview
Problem
Current methods for forming patterns on substrates for high-output LEDs, such as using etching processes, result in low uniformity and high costs due to contamination and equipment requirements, leading to reduced yield and increased heat generation, which degrades device performance and lifespan.
Innovation Solution
A method involving the use of selective cohesion bonding agents to pattern oxide beads on substrates, where a first bonding agent with selective cohesion is used to position oxide beads, and a second bonding agent with varying cohesion is applied to ensure precise placement and thermal processing, eliminating the need for dry etching and expensive equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If dry etching process is used to form patterns on sapphire substrate, then patterns can be formed, but contamination occurs and uniformity is low
Solution Approach 1:
The patent extracts and removes the harmful etching process entirely, replacing it with a bonding-based approach using oxide beads and bonding agents that achieves pattern formation without contamination
Solution Approach 2:
The patent introduces oxide beads as intermediary elements that mediate between the substrate and the bonding agents, enabling precise pattern formation through controlled bonding rather than material removal
2Shape
If thick layer resist and dry etching are used to form semispherical patterns, then patterns can be formed, but etching selectivity limits height and uniformity is low
Solution Approach 1:
The patent uses oxide beads as disposable pattern-forming elements that are applied and then removed after serving their purpose, avoiding the need for complex resist and etching processes
Solution Approach 2:
The patent changes the fundamental parameter from material removal (etching) to material addition and bonding, allowing precise control of pattern height and shape through bonding agent properties rather than etching selectivity
3Productivity
If high energy gas particles are used in etching, then etching can proceed, but damages occur in substrate surface
Solution Approach 1:
The patent converts the harmful high energy gas particle process into a beneficial low-energy bonding process, where oxide beads and bonding agents work together to form patterns without damaging the substrate
Solution Approach 2:
The patent replaces the mechanical/physical etching process with a chemical bonding process, substituting high energy particle bombardment with controlled chemical adhesion between bonding agents and oxide beads
4Temperature
If cooling function equipment is used to manage heat in etching, then excessive heat can be emitted, but equipment cost increases
Solution Approach 1:
The patent extracts and eliminates the need for expensive cooling equipment by removing the heat-generating etching process entirely, replacing it with a low-energy bonding process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents substrate damage, enhances pattern uniformity, increases device yield, and reduces production costs by allowing for high-volume, cost-effective fabrication of substrates with improved light extracting efficiency.
Implementation Method 1
coating a second bonding agent having larger cohesion with the first bonding agent than cohesion with the substrate, on a plurality of oxide beads
Implementation Method 2
thermally processing the substrate
Data Source
AI summary
Provided is a method of fabricating a substrate where patterns are formed, the method including: forming first bonding agent patterns having selective cohesion in a position in which oxide bead patterns are to be formed on a substrate; coating a second bonding agent having larger cohesion with the first bonding agent than cohesion with the substrate, on a plurality of oxide beads, applying the oxide beads, on which the second bonding agent is coated, to the substrate and forming the oxide beads, on which the second bonding agent is coated, on the first bonding agent patterns; and thermally processing the substrate.