Oxide-Coated Bonding Wire for Dense Semiconductor Packaging

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Solution Overview

Problem

As semiconductor chips miniaturize and multiple layers are stacked, electrical short circuits occur due to metal bonding wires sticking together, necessitating a solution to prevent this shorting phenomenon.

Innovation Solution

A bonding wire coated with oxide insulation, comprising a metal core and an oxide insulation coating, is used to electrically connect substrates and semiconductor chips, with fragments of the oxide insulation coating enhancing adhesion and preventing short circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If bonding wires are used to electrically connect substrate and semiconductor chip, then electrical connection is achieved, but metal wires stick together causing short circuits

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidshort circuit

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

An oxide insulation coating is introduced as an intermediary layer between the metal core of bonding wires and surrounding environments. This coating prevents direct contact between adjacent bonding wires, eliminating the short circuit issue while maintaining electrical connection functionality through the insulated metal core.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The bonding wire is constructed as a composite structure with a metal core providing electrical conductivity and an oxide insulation coating providing electrical isolation. This composite design combines the advantages of both materials: the metal ensures good electrical connection while the oxide layer prevents harmful short circuits between adjacent wires.

Inventive Principle:

Principle #40Composite materials

2Productivity

If chip pad and bonding wires are miniaturized for integrated packages, then integration density is improved, but short circuit risk increases due to wire sticking

Engineering Contradiction:

Improveintegration densityVSAvoidshort circuit

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The oxide insulation coating serves as a mediator that enables miniaturization by preventing short circuits between closely spaced bonding wires. This allows the bonding wires to be placed closer together, increasing integration density while maintaining electrical isolation through the insulating coating.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

By changing the physical and chemical parameters of the bonding wire structure (adding oxide coating with specific thickness and properties), the system achieves both miniaturization and short circuit prevention. The oxide coating parameters (thickness, composition) are optimized to enable high-density integration without compromising insulation performance.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If oxide insulation coating is applied to bonding wire, then short circuit prevention is improved, but coating uniformity and quality must be maintained

Engineering Contradiction:

Improveinsulation performanceVSAvoidcoating uniformity

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The oxide insulation coating is formed by controlling parameters such as thickness (10-100 nm), composition (aluminum oxide, titanium oxide, zirconium oxide, or hafnium oxide), and crystalline structure. By optimizing these parameters, the coating achieves both excellent insulation performance for short circuit prevention and sufficient uniformity for reliable manufacturing.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The oxide-insulated bonding wire prevents shorting, allows high-density integration, and maintains stability with excellent insulation and bonding properties, even when miniaturized.

Implementation Method 1

an oxide insulation coating covering the metal core

Methodology Applied

Scientific EffectElectrical insulation: Electrical Resistance

Implementation Method 2

first fragments located in a first portion where the substrate and the bonding wire are connected, the first fragments being formed of the same material as the oxide insulation coating of the bonding wire

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS12482783B2Semiconductor package including bonding wire coated with oxide insulation, electronic system including same, and battery module including same

Publication Date: 2025.11.25 PARK SOO JAE

AI summary

Provided is a semiconductor package including a bonding wire coated with oxide insulation, an electronic system including same, and a battery module including same. The semiconductor package includes: a substrate; a semiconductor chip mounted on the substrate; a bonding wire connecting the substrate and the semiconductor chip and including a metal core portion located on the inside and an oxide insulation coating portion coating the metal core portion; and first fragments made of the same material as the oxide insulation coating portion of the bonding wire and located at a first portion at which the substrate and the bonding wire are connected.