Transparent Oxide Thin Film for Particle Coverage in OLED Electrodes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Light emitting display devices suffer from defects due to particles present during the fabrication of the light emitting diode display panel, leading to poor adhesive force, cracking of the organic substance layer, and electrical connections that impair the reliability of the product.
Innovation Solution
A light emitting display device is fabricated with a transparent oxide thin film of 1 Ř200 Šthickness formed on the entire surface of the first electrode to cover particles, followed by an organic light emitting layer and a second electrode, using conductive metals like aluminum, aluminum alloy, copper, silver, titanium, or chromium, which are naturally oxidized, and a method that includes forming switching devices, buffer layers, and separators to separate the light emitting regions into sub-pixel units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple deposition and patterning processes are performed to form conductive metal layers and insulating layers, then the light emitting display panel can be fabricated with required functional layers, but particles are generated and adhered to layer surfaces causing defects
Solution Approach 1:
A protective film is formed on the conductive metal layer surface before subsequent deposition and patterning processes. This preliminary protective layer prevents particles from adhering to the metal layer during fabrication, while being removable later to expose the clean metal layer for bonding.
Solution Approach 2:
The protective film acts as an intermediary layer between the conductive metal layer and the environment during fabrication. It mediates the harmful effect of particle generation by providing a sacrificial surface that particles can adhere to instead of the critical metal layer.
2Reliability
If particles are present between the organic substance layer and conductive metal layer, then adhesive force deteriorates and cracks occur, but removing particles requires additional complex processes
Solution Approach 1:
The protective film is formed in advance on the conductive metal layer to prevent particle adhesion during fabrication. This preliminary protection eliminates the need for complex particle removal processes later, as particles are prevented from reaching critical interfaces in the first place.
Solution Approach 2:
The harmful particles are effectively extracted from the system by providing the protective film as a sacrificial surface. Particles that would otherwise contaminate critical layers are captured on the removable protective film, which can then be discarded without affecting the underlying functional layers.
3Reliability
If particles connect conductive metal layers electrically, then dark spots are formed and product reliability is impaired, but preventing this requires complex contamination control
Solution Approach 1:
The protective film is applied to the conductive metal layer before subsequent fabrication steps. This preliminary protection prevents particles from bridging electrical connections between metal layers, eliminating dark spots without requiring complex contamination control measures throughout the fabrication process.
Solution Approach 2:
The protective film serves as an intermediary barrier that prevents direct contact between particles and conductive metal layers. This simple intermediary layer effectively blocks the formation of electrical connections through particles, maintaining electrical reliability without complex process controls.
4Ease of manufacture
If the conductive metal layer is moved to another process line for subsequent layer formation, then fabrication can proceed with specialized equipment, but particle contamination increases
Solution Approach 1:
The protective film is formed on the conductive metal layer before it is transferred to another process line. This preliminary protection allows the layer to be moved through subsequent deposition and patterning processes in specialized equipment without becoming contaminated by particles generated in those processes.
Solution Approach 2:
The protective film acts as an intermediary protective barrier during transfer between process lines. It shields the conductive metal layer from particle contamination in subsequent processes while allowing the layer to be handled and processed with specialized equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents defects caused by particles, enhances the adhesive force between the organic light emitting layer and the electrodes, improves fabrication efficiency, and reduces dark spots, thereby increasing the reliability and image display efficiency of the light emitting display device.
Implementation Method 1
a transparent oxide thin film of 1 Ř200 Šthickness being formed on an entire surface of the first electrode to cover particle present on the entire surface of the first electrode fully
Implementation Method 2
using conductive metals like aluminum, aluminum alloy, copper, silver, titanium, or chromium, which are naturally oxidized
Data Source
AI summary
A light emitting display device includes a first electrode formed at a light emitting region of a first substrate; a transparent oxide thin film of about 1 Å to about 200 Å in thickness formed on an entire surface of the first electrode at the light emitting region to substantially cover particle on the entire surface of the first electrode; an organic light emitting layer formed on an entire surface of the oxide thin film to emit a light; and a second electrode formed on an entire surface of the first substrate including the organic light emitting layer.