Oxide Gate Insulator Coating for Low-Temperature High-k TFTs

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Solution Overview

Problem

Current methods for producing field-effect transistors with oxide insulator films having high dielectric constants are costly and complex, requiring vacuum processes and limiting the control over film formulation and characteristics.

Innovation Solution

A field-effect transistor with a gate insulating layer composed of an oxide insulator film containing Zr, Hf, Be, Mg, Sc, Y, or lanthanoid elements, formed using a coating liquid that includes these elements and a solvent, allowing for low-temperature processing and high dielectric constant films.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If vacuum processes (sputtering, CVD, ALD) are used to form oxide insulator films, then film quality and dielectric constant are improved, but apparatus complexity and manufacturing cost increase

Engineering Contradiction:
Improvefilm qualityVSAvoidapparatus complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces vacuum-based physical vapor deposition (sputtering) and chemical vapor deposition (CVD) processes with a liquid-phase coating method. Instead of using complex vacuum chambers and source gases, the invention uses liquid precursors that are coated onto substrates and then thermally processed to form high-quality oxide insulator films with high dielectric constants, thereby eliminating the need for expensive vacuum apparatus while maintaining film quality

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention changes the physical state of the precursor material from gaseous (in CVD/sputtering) to liquid form. This parameter change enables the use of simple coating techniques such as spin coating, dip coating, or spray coating instead of complex vacuum deposition processes, while still achieving high-quality oxide films through subsequent thermal treatment

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If vacuum processes are used to form oxide insulator films, then film characteristics are controlled, but source gas limitations restrict formulation flexibility

Engineering Contradiction:
Improvefilm characteristics controlVSAvoidformulation flexibility
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The patent changes the precursor delivery system from gaseous to liquid state, which fundamentally expands formulation flexibility. Liquid precursors can incorporate a wide variety of metal salts, organic ligands, and additives that are not feasible in gas-phase processes, enabling precise control over film composition, stoichiometry, and properties while maintaining manufacturing precision through controlled thermal processing

Inventive Principle:
Principle #35Parameter changes

3Temperature

If conventional methods are used to produce high dielectric constant oxide films, then process temperature is reduced, but film uniformity and quality deteriorate

Engineering Contradiction:
Improveprocess temperatureVSAvoidfilm uniformity
Core Design Contradiction:
TemperatureVSManufacturing precision

Solution Approach 1:

The invention changes the chemical composition and reactivity of the precursor materials to enable low-temperature film formation. By using specially designed liquid precursors with appropriate decomposition temperatures and reaction kinetics, high-quality uniform oxide films with high dielectric constants can be formed at lower processing temperatures than conventional methods, improving both energy efficiency and film quality

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables the production of field-effect transistors with high dielectric constant oxide insulator films at low process temperatures, reducing costs and improving film uniformity and characteristics.

Implementation Method 1

A field-effect transistor with a gate insulating layer composed of an oxide insulator film containing Zr, Hf, Be, Mg, Sc, Y, or lanthanoid elements, formed using a coating liquid that includes these elements and a solvent

Methodology Applied
Scientific EffectEvaporation: Evaporation

Data Source

PatentUS11901431B2Coating liquid for forming metal oxide film, oxide insulator film, field-effect transistor, display element, image display device, and system
Publication Date: 2024.02.13 RICOH CO LTD
  • US11901431B2 patent drawing
  • US11901431B2 patent drawing
  • US11901431B2 patent drawing

AI summary

A field-effect transistor including: a source electrode and a drain electrode; a gate electrode; a semiconductor layer; and a gate insulating layer, wherein the gate insulating layer is an oxide insulator film including A element and B element, the A element being one or more selected from the group consisting of Zr and Hf and the B element being one or more selected from the group consisting of Be and Mg.