Oxide Semiconductor Memory Cells for Low-Leakage Bitlines

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Solution Overview

Problem

Parasitic capacitance between the source/drain regions of transistors and the semiconductor substrate in memory devices increases bitline capacitance, leading to higher leakage current, reduced retention time, and increased power consumption.

Innovation Solution

Incorporating oxide semiconductors in memory devices with specific configurations, including access transistors and capacitors, to reduce parasitic capacitance and enhance retention time.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If transistors are implemented with silicon semiconductors, then the memory device can achieve basic transistor functionality, but parasitic capacitance between source/drain regions and substrate increases, leading to increased bitline capacitance

Engineering Contradiction:
Improvetransistor functionalityVSAvoidparasitic capacitance
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent changes the material parameter from silicon semiconductor to oxide semiconductor, which fundamentally alters the electrical characteristics. This material substitution reduces parasitic capacitance between source/drain regions and substrate while maintaining transistor functionality, directly resolving the technical contradiction

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs oxide semiconductor materials as a composite solution that combines the desired transistor functionality with reduced parasitic capacitance characteristics. The oxide semiconductor layer works in conjunction with other device components to achieve both functional reliability and reduced harmful capacitance effects

Inventive Principle:
Principle #40Composite materials

2Speed

If voltage difference between source and drain increases, then transistor switching capability improves, but leakage current increases, causing decreased retention time

Engineering Contradiction:
Improvetransistor switching capabilityVSAvoidleakage current
Core Design Contradiction:
SpeedVSLoss of energy

Solution Approach 1:

The patent changes the semiconductor material parameter to oxide semiconductor, which has fundamentally different electrical properties including lower leakage current characteristics. This allows the device to maintain effective switching capability while significantly reducing leakage current, thereby resolving the contradiction between switching speed and energy loss

Inventive Principle:
Principle #35Parameter changes

3Speed

If retention time decreases, then memory device can operate faster, but power consumption increases

Engineering Contradiction:
Improveoperating speedVSAvoidpower consumption
Core Design Contradiction:
SpeedVSUse of energy by stationary object

Solution Approach 1:

By changing the material parameter to oxide semiconductor, the patent achieves a device that maintains data retention for longer periods without requiring excessive refresh operations. This reduces the overall power consumption while maintaining operational speed, as the lower leakage current characteristic allows for slower refresh cycles

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS12543305B2Memory device
Publication Date: 2026.02.03 SAMSUNG ELECTRONICS CO LTD
  • US12543305B2 patent drawing
  • US12543305B2 patent drawing
  • US12543305B2 patent drawing

AI summary

A memory device includes a first memory cell connected to a first bitline and a second memory cell connected to a second bitline, wherein the first memory cell may include a first access transistor including one end connected to the first bitline, and a first capacitor including one electrode connected to another end of the first access transistor and another electrode connected to the second bitline, and the first access transistor may include an oxide semiconductor.