Oxide Semiconductor Driver Circuit Integration
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Solution Overview
Problem
The increasing number of gate lines and signal lines in display devices leads to higher manufacturing costs and contact resistance issues, making it difficult to mount IC chips and reducing the speed of driver circuits, while also increasing the number of contact holes and area occupied by driver circuits.
Innovation Solution
A display device is designed where a pixel portion and at least a part of the driver circuit are formed using thin film transistors with an oxide semiconductor over the same substrate, utilizing an InMO3(ZnO)m material with M being one or more metal elements like Ga, Fe, Ni, or Co, and incorporating a transition metal element as an impurity, which reduces contact resistance and manufacturing costs by direct connection of gate electrodes to source or drain wiring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the number of gate lines and signal lines is increased to improve display definition, then the definition is improved, but manufacturing costs increase and IC chip mounting becomes difficult
Solution Approach 1:
The patent merges the driver circuit functions directly into the display panel by forming thin film transistors and wiring structures on the same substrate as the pixel portion. This integration eliminates the need for separate IC chip mounting, thereby reducing manufacturing costs while supporting higher display definitions through increased gate lines and signal lines.
Solution Approach 2:
The substrate serves multiple functions: it acts as both the base for pixel portions and the platform for driver circuit formation. The same substrate accommodates both display elements and driving electronics, reducing the need for additional components and simplifying the manufacturing process.
2Measurement precision
If the number of gate lines and signal lines is increased to improve display definition, then the definition is improved, but contact resistance increases and driver circuit speed decreases
Solution Approach 1:
By integrating the driver circuit directly on the substrate with the pixel portion, the patent minimizes the number of external connections and contact interfaces required. The direct formation of wiring structures reduces contact resistance and improves signal transmission speed, enabling support for higher display definitions.
3Extent of automation
If IC chip mounting is used to drive gate lines and signal lines, then driving capability is provided, but manufacturing costs increase
Solution Approach 1:
The patent combines the driver circuit functionality directly into the display panel structure by forming thin film transistors and wiring on the same substrate. This integration eliminates the need for separate IC chip mounting processes, thereby reducing manufacturing costs while maintaining full driving capability for gate lines and signal lines.
Solution Approach 2:
The display panel becomes self-sufficient by incorporating its own driver circuitry on the same substrate. The panel generates and controls its own driving signals through the integrated thin film transistor-based driver circuit, eliminating the need for external IC chips and reducing manufacturing complexity.
4Extent of automation
If conventional thin film transistors are used to form driver circuits, then driver circuits can be formed, but contact resistance is high and manufacturing is complex
Solution Approach 1:
The patent changes the material parameter by using oxide semiconductor films instead of conventional semiconductor materials for forming thin film transistors. This material substitution enables lower temperature processing and simpler manufacturing steps while reducing contact resistance, making driver circuit formation more feasible and less complex.
Solution Approach 2:
The patent applies oxide semiconductor materials specifically in the channel formation regions of thin film transistors used in driver circuits. This localized application optimizes the electrical characteristics where needed (reducing contact resistance) while maintaining manufacturing simplicity through lower temperature processing compared to conventional materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces manufacturing costs, contact resistance, and the number of contact holes, enabling high-speed driving of the driver circuit and minimizing the area occupied by driver circuits, while maintaining high electric characteristics such as on/off ratio and mobility.
Implementation Method 1
The oxide semiconductor film can be formed by sputtering or the like at a temperature of lower than or equal to 300° C.
Data Source
AI summary
With an increase in the definition of a display device, the number of pixels is increased, and thus the numbers of gate lines and signal lines are increased. The increase in the numbers of gate lines and signal lines makes it difficult to mount an IC chip having a driver circuit for driving the gate line and the signal line by bonding or the like, which causes an increase in manufacturing costs. A pixel portion and a driver circuit driving the pixel portion are provided over the same substrate. The pixel portion and at least a part of the driver circuit are formed using thin film transistors in each of which an oxide semiconductor is used. Both the pixel portion and the driver circuit are provided over the same substrate, whereby manufacturing costs are reduced.