Oxide Semiconductor Transistor Circuit for Low Power Memory

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current semiconductor devices face challenges in achieving favorable electrical characteristics, miniaturization, high switching and writing speeds, low power consumption, and reliable memory retention, particularly with transistors using oxide semiconductor films.

Innovation Solution

A semiconductor device comprising a capacitor and transistors with an oxide semiconductor film, where the electrostatic capacitance is optimized, and the transistors have channel lengths suitable for miniaturization, enabling improved switching and writing speeds, and low power consumption, with the oxide semiconductor film containing specific elements like In, Ga, and Zn, and featuring c-axis aligned crystal parts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If transistors are miniaturized to increase integration density, then device size is reduced, but electrical characteristics and reliability deteriorate

Engineering Contradiction:
Improvedevice sizeVSAvoidelectrical characteristics
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent changes the material parameter from conventional semiconductor to oxide semiconductor, which fundamentally alters the electrical characteristics. This material substitution enables miniaturized transistors to maintain favorable electrical characteristics and reliability by leveraging the unique properties of oxide semiconductors, such as their ability to form stable interfaces and control carrier concentrations even at reduced dimensions.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs composite material structures including oxide semiconductor films combined with specific gate insulator materials and electrode materials. These composite structures are designed to optimize both the electrical performance and reliability of miniaturized transistors, allowing high integration density while maintaining device quality through carefully engineered material combinations.

Inventive Principle:
Principle #40Composite materials

2Volume of moving object

If transistor channel length is reduced for miniaturization, then integration density increases, but switching speed decreases

Engineering Contradiction:
Improvetransistor sizeVSAvoidswitching speed
Core Design Contradiction:
Volume of moving objectVSSpeed

Solution Approach 1:

The patent utilizes parameter changes in the oxide semiconductor material properties, specifically controlling carrier concentration and mobility, to achieve fast switching speeds in miniaturized transistors. By optimizing these material parameters, the invention overcomes the typical speed degradation associated with reduced channel length while maintaining high integration density.

Inventive Principle:
Principle #35Parameter changes

3Volume of moving object

If capacitor electrostatic capacitance is reduced for miniaturization, then device size is reduced, but memory retention characteristics deteriorate

Engineering Contradiction:
Improvecapacitor sizeVSAvoidmemory retention time
Core Design Contradiction:
Volume of moving objectVSDuration of action of stationary object

Solution Approach 1:

The patent changes the material composition and structural parameters of the capacitor, utilizing oxide semiconductor-based structures that achieve high capacitance density. This material substitution allows the capacitor to maintain adequate electrostatic capacitance and memory retention characteristics even when miniaturized, overcoming the typical trade-off between size and retention performance.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS9685500B2Circuit system
Publication Date: 2017.06.20 SEMICON ENERGY LAB CO LTD
  • US9685500B2 patent drawing
  • US9685500B2 patent drawing
  • US9685500B2 patent drawing

AI summary

A semiconductor device with a transistor having favorable electrical characteristics is provided. The semiconductor device has a memory circuit and a circuit that are over the same substrate. The memory circuit includes a capacitor, a first transistor, and a second transistor. A gate of the first transistor is electrically connected to the capacitor and one of a source and a drain of the second transistor. The circuit includes a third transistor and a fourth transistor that are electrically connected to each other in series. The first transistor and the third transistor each include an active layer including silicon, and the second transistor and the fourth transistor each include an active layer including an oxide semiconductor.