Composite Oxide-Silicon TFT Structure for Mobility and Stability

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Solution Overview

Problem

Current thin film transistors face challenges in achieving a balance between high mobility, stability, and low manufacturing costs, with amorphous silicon transistors having low mobility, polycrystalline silicon transistors being costly and difficult to manufacture uniformly, and oxide semiconductor transistors having low stability and mobility.

Innovation Solution

A thin film transistor design incorporating both a silicon semiconductor layer and an oxide semiconductor layer, with specific overlapping configurations and doping processes to enhance mobility and stability, allowing for improved switching properties and large s-factor performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If amorphous silicon is used as the active layer material, then manufacturing time is short and manufacturing cost is low, but electron mobility is low and threshold voltage changes

Engineering Contradiction:
Improvemanufacturing timeVSAvoidthreshold voltage stability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent uses a composite active layer structure combining amorphous silicon and oxide semiconductor materials. The amorphous silicon layer provides fast deposition and low cost, while the oxide semiconductor layer provides high stability and mobility. This composite structure resolves the contradiction by integrating the advantages of both materials while mitigating their individual weaknesses.

Inventive Principle:
Principle #40Composite materials

2Reliability

If polycrystalline silicon is used as the active layer material, then electron mobility is high and stability is great, but manufacturing cost increases due to additional crystallization steps and high temperature processing

Engineering Contradiction:
Improvetransistor stabilityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces the expensive polycrystalline silicon structure with a composite of amorphous silicon and oxide semiconductor. This combination achieves comparable or superior stability without requiring high-temperature crystallization processes, thereby reducing manufacturing complexity and cost while maintaining high electron mobility.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent changes the material composition parameters of the active layer, using oxide semiconductor with specific oxygen content to achieve high stability and mobility. This parameter change allows obtaining polycrystalline-like performance at lower temperatures and with simpler processes.

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If oxide semiconductor is used as the active layer material, then manufacturing cost is low and transparency is achieved, but electron mobility is low and stability is low

Engineering Contradiction:
Improvemanufacturing costVSAvoidtransistor stability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent creates a composite active layer where oxide semiconductor is combined with amorphous silicon. The oxide semiconductor component provides low-cost deposition and transparency, while the amorphous silicon component enhances electron mobility and stability. This composite approach resolves the limitations of pure oxide semiconductor while preserving its cost and transparency advantages.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS11901461B2Thin film transistor comprising oxide semiconductor layer and silicon semiconductor layer and display apparatus comprising the same
Publication Date: 2024.02.13 LG DISPLAY CO LTD
  • US11901461B2 patent drawing
  • US11901461B2 patent drawing
  • US11901461B2 patent drawing

AI summary

Disclosed are a thin film transistor, a display apparatus comprising the thin film transistor, and a method for manufacturing the thin film transistor. The thin film transistor comprises an active layer, and a gate electrode spaced apart from the active layer and configured to have at least a portion overlapped with the active layer, wherein the active layer includes a silicon semiconductor layer, and an oxide semiconductor layer which contacts the silicon semiconductor layer, wherein at least a portion of the silicon semiconductor layer and at least a portion of the oxide semiconductor layer are overlapped with the gate electrode.