Oxide Spacing Area Identification via Pattern Density Analysis
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Solution Overview
Problem
In the CMP process, identifying the location and size of oxide spacing areas is crucial to prevent dishing defects, especially since actual product patterns are irregular and inconsistent, making it challenging to simulate product data without extracting these parameters.
Innovation Solution
A method is developed to derive the location and size of oxide spacing areas by calculating numerical values such as pattern density difference, minimum row/column pattern density, and row/column pattern density difference based on layout data, allowing for the determination of oxide spacing areas in both testkey and product GDS files.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If regular testkey patterns are used to establish models, then model accuracy is improved, but applicability to actual product patterns deteriorates due to irregular and inconsistent product patterns
Solution Approach 1:
The patent transforms the approach from using fixed regular patterns to using extracted parameters (pattern density, spacing area dimensions, step height) that can vary according to actual product characteristics. By changing from a fixed model to a parameter-based model that adapts to different pattern densities and spacing configurations, the solution maintains accuracy while improving applicability to irregular product patterns.
2Adaptability or versatility
If oxide spacing area parameters are extracted from irregular product patterns, then applicability is improved, but measurement precision deteriorates due to pattern irregularity and inconsistency
Solution Approach 1:
The patent segments the complex irregular product patterns into discrete measurable elements: pattern density values, spacing area locations, spacing area widths, and step heights. By breaking down the irregular patterns into standardized parameter categories, the system can accurately extract and measure each element independently, maintaining precision even when overall patterns are irregular and inconsistent.
3Reliability
If spacing area width is increased to reduce step height, then dishing defect risk is reduced, but manufacturing precision deteriorates due to larger spacing areas
Solution Approach 1:
The patent applies different spacing area width requirements to different local regions based on their specific pattern density and step height characteristics. Rather than uniformly increasing spacing width everywhere, the system identifies high-risk locations with large step heights and targets those specific areas for spacing width adjustment. This localized approach prevents dishing defects where needed while maintaining tighter spacing control in areas where it is safe, thus preserving manufacturing precision.
Data Source
AI summary
A method to derive the location and size of oxide spacing area is provided in the present invention, including steps of dividing a tested region into a plurality of grid units, each grid unit consists of a plurality of sub-grid units, calculating a pattern density difference, a minimum row/column pattern density and a row/column pattern density difference of every grid unit based on layout data, and determining a grid unit as where an oxide spacing area locates at when its pattern density difference is greater than a first predetermined value, its minimum row/column pattern density is less than a second predetermined value and its row/column pattern density difference is greater than a third predetermined value.


