Oxide Semiconductor Circuit Substrate for Uniform Low-Leak Displays

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Solution Overview

Problem

Existing display devices using silicon-based semiconductors exhibit significant variations in electrical characteristics, leading to non-uniform display quality and high power consumption due to large off-leak currents and threshold voltage variations.

Innovation Solution

Incorporating a capacitor structure with a first electrode, insulating film, and a second electrode, and a first transistor with an oxide semiconductor film connected to source and drain electrodes, which reduces the area occupied by the transistor and increases channel width, allowing high luminance and reduced power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If silicon-based semiconductors are used in display devices, then the device can be manufactured with established processes, but significant variations in electrical characteristics occur leading to non-uniform display quality and high power consumption

Engineering Contradiction:
Improvemanufacturing process establishmentVSAvoidelectrical characteristic uniformity
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent changes the material parameter from silicon-based semiconductor to oxide semiconductor, which fundamentally alters the electrical characteristics. This material substitution enables reduced off-leak currents and threshold voltage variations while maintaining manufacturability through sputtering and other established thin-film deposition techniques, thus resolving the contradiction between ease of manufacture and electrical characteristic uniformity

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs composite material structures including oxide semiconductor films combined with specific insulating films (such as silicon oxide, silicon nitride) and electrode materials. This composite approach leverages the advantages of each material to achieve both manufacturability and improved electrical uniformity, with the oxide semiconductor providing stable electrical characteristics and the insulating films providing structural support and electrical isolation

Inventive Principle:
Principle #40Composite materials

2Reliability

If transistor area is reduced to increase channel width, then display uniformity improves, but manufacturing precision requirements increase

Engineering Contradiction:
Improvedisplay uniformityVSAvoidtransistor fabrication precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent changes the semiconductor material parameters by using oxide semiconductors with specific thickness ranges (50-200 nm) and controlled oxygen content. This material parameter optimization allows for reduced transistor area while maintaining electrical characteristic uniformity, as the oxide semiconductor's inherent stability compensates for the reduced device dimensions, thus improving display uniformity without excessively increasing manufacturing precision requirements

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent optimizes the vertical dimension by controlling the thickness of oxide semiconductor films and insulating film layers. By precisely controlling the thickness parameters in the vertical dimension (e.g., oxide semiconductor film thickness of 50-200 nm), the patent achieves improved electrical uniformity and display quality while maintaining manufacturable horizontal dimensions, effectively using dimensional optimization to resolve the contradiction

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS12588287B2Circuit substrate
Publication Date: 2026.03.24 MAGNOLIA WHITE CORP
  • US12588287B2 patent drawing
  • US12588287B2 patent drawing
  • US12588287B2 patent drawing

AI summary

Provided is a display device including: a capacitor having a first electrode, a first insulating film over the first electrode, and a second electrode over the first insulating film; and a first transistor over the capacitor. The first transistor includes the second electrode, a second insulating film over the second electrode, an oxide semiconductor film over the second insulating film, and a first source electrode and a first drain electrode over the oxide semiconductor film. The first source electrode and the first drain electrode are electrically connected to the oxide semiconductor film.