Oxide Superconducting Wire Cu Stabilizing Layer Overcurrent
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Solution Overview
Problem
Oxide superconducting thin film wires face issues with maintaining superconductivity when an electric current higher than the critical current flows, leading to heat generation and potential 'burnout' due to increased resistance, and thicker stabilizing layers make the wires more difficult to bend and increase production costs.
Innovation Solution
Incorporating a Cu stabilizing layer that surrounds the laminate and is electrically conductive with the metal substrate's conductive layer, either through direct contact or via through holes, to manage overcurrents without increasing the thickness of stabilizing layers, allowing for easier bending and reduced production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thickness of the stabilizing layer is increased to reduce electrical resistance and suppress heat generation, then the ability to endure overcurrent is improved, but the ease of bending the wire deteriorates
Solution Approach 1:
The stabilizing layer is divided into multiple segments: a first stabilizing layer (Ag) in direct contact with the oxide superconducting layer, and a second stabilizing layer (Cu) surrounding the first stabilizing layer. This segmentation allows each layer to have optimized thickness and material properties, enabling the Cu layer to provide superior electrical conductivity for overcurrent protection while the Ag layer maintains interface quality, thus resolving the contradiction between overcurrent endurance and bendability.
Solution Approach 2:
The patent employs a composite stabilizing structure combining Ag and Cu materials with different properties. The Ag layer provides good adhesion to the superconducting layer and acceptable conductivity, while the Cu layer provides exceptional electrical conductivity for overcurrent paths. This composite approach achieves enhanced overcurrent endurance without requiring excessive total stabilizing layer thickness, thereby maintaining wire flexibility.
2Reliability
If a Cu stabilizing layer is added to improve overcurrent endurance, then the reliability is improved, but the device complexity increases
Solution Approach 1:
The Cu stabilizing layer is merged with the existing Ag stabilizing layer to form an integrated multi-layer stabilizing structure. The Cu layer surrounds the Ag layer, creating a unified stabilizing system that leverages the complementary properties of both materials. This merging approach achieves enhanced overcurrent protection while maintaining a relatively simple overall structure that can be manufactured using conventional processes.
3Reliability
If the stabilizing layer thickness is increased to prevent burnout, then the safety is improved, but the production cost increases
Solution Approach 1:
The patent optimizes the thickness parameters of the stabilizing layers to achieve the minimum required protection against burnout. By carefully controlling the thickness of the Ag layer (in contact with the superconducting layer) and the Cu layer (surrounding the Ag layer), the design achieves adequate overcurrent protection with minimized material usage and manufacturing complexity, thereby controlling production costs while ensuring safety.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables oxide superconducting thin film wires to endure large overcurrents while maintaining ease of bending and reducing the risk of heat generation, thus enhancing their operational stability and production efficiency.
Implementation Method 1
at least one of the Cu stabilizing layer and the Ag stabilizing layer is formed so as to be in contact with at least a portion of the conductive layer of the metal substrate and be electrically conductive with the conductive layer of the metal substrate
Implementation Method 2
an oxide superconducting layer made of, for example, an oxide superconducting material represented by REBCO
Data Source
AI summary
An oxide superconducting thin film wire includes a metal substrate, a laminate, and a Cu stabilizing layer. The metal substrate includes a supporting base material and a conductive layer located on the supporting base material. The conductive layer includes a Cu layer serving as an internal layer and a biaxially orientated surface layer. The laminate includes a buffer layer, an oxide superconducting layer, and a Ag stabilizing layer stacked on the metal substrate in this order from the metal substrate. The Cu stabilizing layer is formed so as to surround the laminate and the metal substrate. At least one of the Cu stabilizing layer and the Ag stabilizing layer is formed so as to be in contact with at least a portion of the conductive layer of the metal substrate and be electrically conductive with the conductive layer of the metal substrate.