Oxide Thin Film Transistor Sidewall Isolation Against Oxygen Diffusion

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Solution Overview

Problem

The reliability of the active layer in multilayer oxide thin film transistors is poor, affecting the display effect due to oxygen diffusion and oxidation of source-drain metal layers during high temperature processes.

Innovation Solution

A metal oxide active layer is designed with a carrier transport layer and a carrier isolation layer, where the carrier isolation layer covers the lateral surface of the carrier transport layer, reducing oxygen diffusion and oxidation, and a via hole or blind hole is defined in the carrier isolation layer to enhance electrical coupling and reduce resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a multilayer oxide thin film transistor is designed with multiple high mobility and high impedance layers to improve mobility and stability, then the mobility and stability are improved, but the reliability of the active layer deteriorates due to oxygen diffusion and oxidation during high temperature processes

Engineering Contradiction:
Improveactive layer reliabilityVSAvoidoxygen diffusion and oxidation
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A carrier isolation layer is introduced as an intermediary between the carrier transport layer and the environment. This isolation layer specifically targets and blocks oxygen diffusion pathways, preventing oxidation of the source-drain metal layers while maintaining the electrical performance benefits of the multilayer structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The active layer is constructed as a composite structure with at least two different metal oxide materials having different band gaps. The carrier transport layer and carrier isolation layer use different metal oxide materials, creating a composite system where each layer performs its specific function - one layer transports carriers efficiently while the other isolates and protects from oxygen diffusion.

Inventive Principle:
Principle #40Composite materials

2Object-affected harmful factors

If the carrier isolation layer covers the lateral surface of the carrier transport layer to prevent oxygen diffusion, then oxidation resistance is improved, but device complexity increases due to additional layer configuration

Engineering Contradiction:
Improveoxidation resistanceVSAvoidactive layer structure complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The active layer is segmented into functionally distinct layers - a carrier transport layer and a carrier isolation layer. Each segment performs a specific function: one transports carriers while the other isolates and protects. This segmentation allows the complex protection function to be achieved through specialized, simplified layers rather than a single complex structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the active layer are assigned different properties. The carrier transport layer has high mobility properties optimized for charge transport, while the carrier isolation layer has high impedance properties optimized for oxygen barrier function. Each layer's material composition and structure are locally optimized for its specific function, simplifying the overall design.

Inventive Principle:
Principle #3Local quality

3Reliability

If via holes or blind holes are defined in the carrier isolation layer to enhance electrical coupling, then electrical conductivity is improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improveelectrical couplingVSAvoidhole alignment precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

Instead of requiring precise through-holes through the entire isolation layer, the patent extracts the electrical coupling function to specific locations via via holes or blind holes. These openings are strategically placed only where electrical connection is needed, reducing the overall precision requirements compared to a fully penetrating hole structure while maintaining effective electrical coupling.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves the reliability of the oxide thin film transistor by reducing oxygen diffusion and oxidation, thereby enhancing the stability and performance of the display device.

Implementation Method 1

reducing oxygen diffusion and oxidation

Methodology Applied
Scientific EffectOxygen diffusion: Diffusion

Implementation Method 2

reducing oxygen diffusion and oxidation

Methodology Applied
Scientific EffectOxidation: Oxidation

Implementation Method 3

enhance electrical coupling and reduce resistance

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS12191400B2Oxide thin film transistor, method for manufacturing the same and display device
Publication Date: 2025.01.07 BOE TECHNOLOGY GROUP CO LTD
  • US12191400B2 patent drawing
  • US12191400B2 patent drawing
  • US12191400B2 patent drawing

AI summary

An oxide thin film transistor includes: a gate electrode, a metal oxide active layer and a source-drain metal layer, which are on a base substrate. The metal oxide active layer includes a first metal oxide layer and a second metal oxide layer stacked on the first metal oxide layer in a direction away from the base substrate; the first metal oxide layer is a carrier transport layer; the second metal oxide layer is a carrier isolation layer; an electron transfer rate of the carrier transport layer is greater than an electron transfer rate of the carrier isolation layer. The first metal oxide layer includes a primary surface facing toward the base substrate and a primary surface away from the base substrate; the first metal oxide layer further includes a lateral surface around the primary surfaces; the second metal oxide layer covers the lateral surface of the first metal oxide layer.