Oxide Superconducting Wire Plating Grain Gradient for Crack Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Oxide superconducting wires require enhanced tensile strength in their stabilizing layers to prevent cracks and improve mechanical properties, which existing technologies have not adequately addressed.
Innovation Solution
The oxide superconducting wire incorporates a plating layer with a surface roughness of 1.0 to 2.0 μm and an average crystal grain size of 0.86 to 3.05 μm, with a gradient in crystal grain size between the inner and outer surfaces to balance tensile strength and ductility, formed using electroplating techniques and specific plating solutions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the surface roughness of the plating layer is increased to improve tensile strength, then tensile strength is improved, but cracks occur due to excessive surface roughness
Solution Approach 1:
The invention optimizes the surface roughness parameter of the plating layer to a specific range (Ra 0.5 μm to 2.0 μm) to achieve the best balance between tensile strength and crack resistance. This parameter optimization resolves the contradiction by identifying the optimal value range that simultaneously improves strength while preventing excessive roughness-induced cracking.
2Strength
If the average crystal grain size of the plating layer is increased to improve tensile strength, then tensile strength is improved, but cracks occur due to excessive crystal grain size
Solution Approach 1:
The invention optimizes the average crystal grain size parameter of the plating layer to a specific range (0.86 μm to 3.05 μm) to achieve the best balance between tensile strength and crack resistance. This parameter optimization resolves the contradiction by identifying the optimal grain size range that simultaneously improves strength while preventing excessive grain size-induced cracking.
3Ease of manufacture
If the plating layer is made with uniform crystal grain size to simplify manufacturing, then manufacturing is simplified, but tensile strength and ductility cannot be simultaneously optimized
Solution Approach 1:
The invention implements a non-uniform crystal grain size distribution where the plating layer has different average crystal grain sizes at different positions: 0.86 μm to 2.0 μm near the inner surface adjacent to the superconductor laminate, and 1.5 μm to 3.05 μm near the outer surface. This local quality variation resolves the contradiction by providing finer grains for strength near the critical interface and coarser grains for ductility at the outer surface, while still maintaining manufacturability through controlled electroplating parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses cracks and enhances the tensile strength of the stabilizing layer, improving the practicality and machinability of the oxide superconducting wire while maintaining high ductility on the outer surface.
Implementation Method 1
formed by plating
Data Source
AI summary
An oxide superconducting wire includes a superconductor laminate including an oxide superconducting layer on at least one surface of a base material, and a plating layer which is included in a stabilizing layer of the superconductor laminate and formed by plating. A surface roughness Ra of the plating layer is 1.0 μm or more and 2.0 μm or less. An entire average crystal grain size of the plating layer is 0.86 μm or more and 3.05 μm or less.