Amorphous Metal Oxy-Fluoride Coating for Plasma Chamber Components
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Solution Overview
Problem
Existing coatings for chamber components in semiconductor manufacturing, such as yttrium oxide and yttrium-zirconium binary oxides, are prone to cracking, shedding particles, and increased leakage current due to exposure to fluorine-based plasmas, leading to etch rate drops and process instability.
Innovation Solution
A metal oxy-fluoride coating comprising a combination of yttrium fluoride (YF3), zirconium fluoride (ZrF4), and yttrium oxide (Y2O3) or zirconium oxide (ZrO2) with a composition of 5-90 mol% YF3 or ZrF4 and 10-95 mol% metal oxide, deposited in an amorphous state using methods like vapor deposition or sputtered deposition, which provides enhanced plasma resistance and chemical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If rare earth oxides are used as coating material, then resistance to erosion from plasma etch chemistries is improved, but cracking and shedding of particles onto wafers occurs due to exposure to fluorine based plasma
Solution Approach 1:
The patent uses a composite coating material consisting of metal oxide (Y2O3 or ZrO2) combined with metal fluoride (YF3 or ZrF4) in specific ratios. This composite structure provides both the erosion resistance of the metal oxide and the chemical stability of the metal fluoride, preventing the cracking and particle shedding that occurs with pure rare earth oxide coatings when exposed to fluorine-based plasma.
Solution Approach 2:
The patent changes the chemical composition parameters of the coating by incorporating fluoride compounds at specific concentrations (5-90 mol% metal fluoride, 10-95 mol% metal oxide). This parameter adjustment transforms the coating properties to resist fluorine-based plasma exposure, eliminating the harmful cracking and shedding effects while maintaining erosion resistance.
2Reliability
If oxide coatings such as Y2O3 are used, then plasma resistance is improved, but water permeability increases causing formation of brittle M(OH) layer and increased leakage current
Solution Approach 1:
The patent creates a composite coating system where metal fluoride compounds are combined with metal oxides. The metal fluoride component forms a fluorinated surface layer that is impermeable to water, preventing the formation of brittle hydroxide layers and reducing leakage current while maintaining the plasma resistance provided by the metal oxide base.
Solution Approach 2:
The metal fluoride acts as an intermediary layer between the metal oxide coating and the plasma environment. This intermediate fluorinated layer blocks water penetration to the metal oxide substrate, preventing hydroxide formation and leakage current issues, while still allowing the underlying oxide to provide plasma resistance.
3Object-generated harmful factors
If YF3 coating is applied to chamber components, then particle contamination is reduced, but etch rate drop occurs and process drift is caused
Solution Approach 1:
The patent optimizes the compositional parameters by using metal fluoride at 5-90 mol% and metal oxide at 10-95 mol%, creating a balanced coating that maintains etch rate while reducing particle contamination. This parameter optimization prevents the excessive etch rate drop that occurs with pure YF3 coatings by incorporating the protective metal oxide component.
Solution Approach 2:
The composite coating combines the particle-contamination-reducing properties of metal fluoride with the etch-rate-maintaining properties of metal oxide. The synergistic interaction between these two materials allows the coating to provide protection against particle contamination without causing the significant etch rate drop associated with pure fluoride coatings.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The amorphous metal oxy-fluoride coating significantly reduces particle defects, improves etch rate uniformity, and extends the lifespan of chamber components by resisting erosion and corrosion, while maintaining a stable etch rate and reducing reaction product buildup.
Implementation Method 1
performing one of a vapor deposition, sputtered deposition or evaporated deposition of the metal oxy-fluoride source material to form a metal oxy-fluoride coating on an article
Implementation Method 2
performing one of a vapor deposition, sputtered deposition or evaporated deposition of the metal oxy-fluoride source material to form a metal oxy-fluoride coating on an article
Implementation Method 3
performing one of a vapor deposition, sputtered deposition or evaporated deposition of the metal oxy-fluoride source material to form a metal oxy-fluoride coating on an article
Data Source
AI summary
Described herein is a chamber component including a metal oxy-fluoride coating including YF3, ZrF4 or combination thereof and a metal oxide consisting of Y2O3 and ZrO2. The metal oxy-fluoride coating includes 5 mol % to 90 mol % of YF3 or ZrF4 and 10 mol % to 95 mol % of the metal oxide. The metal oxy-fluoride coating is amorphous and has:35-50 at. % of yttrium (Y);0.3-10 at. % of zirconium (Zr);5-57 at. % of oxygen (O);and3-65 at. % of fluorine (F).