Oxymethylene Polymer Bonding via Copolymer Melting
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Solution Overview
Problem
Existing methods for bonding oxymethylene-based polymers are inadequate in achieving sufficient adhesiveness and preventing thermal contraction and deformation, particularly in injection-molded, extrusion-molded, or stretched materials, due to insufficient bonding strength and heat resistance, and often require additional components or complex processes.
Innovation Solution
A method involving heat treatment of oxymethylene-based polymer compositions with specific melting point differences and DSC-measured peak area distributions to improve adhesiveness between resin materials, where one material has a melting point lower than the other and 50% or more of its peak area is within a temperature region 5°C or more below the other's peak temperature, preventing thermal deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If heat treatment is performed at high temperature for bonding oxymethylene-based polymers, then bonding strength is improved, but thermal contraction and deformation of the structure occur
Solution Approach 1:
The invention changes the melting point parameter of the bonding material by using a copolymer with different comonomer content than the base polymer. This allows the bonding material to melt at a lower temperature than the oxymethylene-based polymer, enabling bonding at temperatures that do not cause thermal contraction or deformation of the structure.
Solution Approach 2:
The invention uses a composite material system consisting of the oxymethylene-based polymer (A) and the copolymer bonding material (B) with different comonomer contents. This composite approach allows the bonding material to have different thermal properties than the base polymer, specifically a lower melting point, enabling effective bonding without compromising the structural integrity of the oxymethylene-based polymer.
2Strength
If conventional bonding materials are used, then bonding can be achieved, but heat resistance of the bonded structure is insufficient
Solution Approach 1:
The invention changes the comonomer content parameter to create a copolymer with a melting point lower than the oxymethylene-based polymer. This ensures that the bonding material melts and bonds the structures together, while the oxymethylene-based polymer with higher melting point maintains its structural integrity and heat resistance in the final bonded product.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances adhesiveness and suppresses thermal contraction and deformation, resulting in a structure with improved bonding strength and heat resistance suitable for environments where conventional oxymethylene-based polymers are used.
Implementation Method 1
an oxymethylene-based polymer composition (B) having a melting point lower than a melting point of the oxymethylene-based polymer (A)
Implementation Method 2
heating the resin materials
Data Source
AI summary
Provided are a method of bonding resin materials for bonding a resin material (X) containing an oxymethylene-based polymer (A) and a resin material (Y), and a structure obtained by the bonding method. The method includes the steps of: preparing as the resin material (Y) an oxymethylene-based polymer composition (B) satisfying the following conditions (1) and (2); or preparing as the resin material (Y) the resin material (X) or another resin material and providing the oxymethylene-based polymer composition (B) between the resin material (Y) and the resin material (X); and heating the resin materials: (1) the oxymethylene-based polymer composition (B) has a melting point lower than that of the oxymethylene-based polymer (A), and a difference in melting point between the composition and the polymer is smaller than 5°C; and (2) 50% or more of a peak area determined from a peak showing the molten state of the oxymethylene-based polymer composition (B) measured by DSC is present in a temperature region lower than the peak temperature of the oxymethylene-based polymer (A) by 5°C or more.