Oxynitride Layer Stack for Electronic Device Package Moisture Blocking

Solution Overview

Problem

Electronic devices face challenges in maintaining moisture and oxygen blocking capabilities, which are essential for preventing performance degradation and damage, especially in sophisticated designs where existing packaging techniques are insufficient.

Innovation Solution

The electronic device package incorporates a first and second oxynitride layer, with the second oxynitride layer between the electronic device and the substrate, formed through a plasma treatment process using polysilazane or polysiloxazane materials, providing a moisture/oxygen-blocking effect while allowing for visible light transmittance and flexibility in design.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional packaging techniques are used, then device simplicity is maintained, but moisture/oxygen blocking capability is insufficient

Engineering Contradiction:

Improvemoisture/oxygen blocking capabilityVSAvoidpackaging structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent employs a composite packaging structure consisting of multiple layers with different compositions: a first oxynitride layer (SiNx1Oy1) and a second oxynitride layer (SiNx2Oy2) where x1>x2. This composite structure combines materials with different properties to achieve superior moisture and oxygen blocking capabilities while maintaining device flexibility and light transmittance requirements.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent applies different oxynitride layer compositions at different locations within the packaging structure. The first oxynitride layer has a higher nitrogen content (x1) compared to the second oxynitride layer (x2), creating local quality variations that optimize both barrier performance and optical properties in different regions of the packaging.

Inventive Principle:

Principle #3Local quality

2Reliability

If thicker packaging layers are used to improve blocking, then moisture/oxygen blocking is enhanced, but light transmittance and flexibility are reduced

Engineering Contradiction:

Improvemoisture/oxygen blocking capabilityVSAvoidvisible light transmittance

Core Design Contradiction:

ReliabilityVSIllumination intensity

Solution Approach 1:

The patent applies different oxynitride layer compositions at different locations within the packaging structure. The first oxynitride layer has a higher nitrogen content (x1) compared to the second oxynitride layer (x2), creating local quality variations that optimize both barrier performance and optical properties in different regions of the packaging.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent employs a composite packaging structure consisting of multiple layers with different compositions: a first oxynitride layer (SiNx1Oy1) and a second oxynitride layer (SiNx2Oy2) where x1>x2. This composite structure combines materials with different properties to achieve superior moisture and oxygen blocking capabilities while maintaining device flexibility and light transmittance requirements.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The oxynitride layer configuration effectively prevents moisture and oxygen ingress, enhancing the reliability and service life of electronic devices by maintaining performance and preventing damage, while also allowing for flexible and transparent display applications.

Implementation Method 1

formed through a plasma treatment process using polysilazane or polysiloxazane materials

Methodology Applied

Scientific EffectPlasma treatment: Plasma

Data Source

PatentUS10396256B2Electronic device package

Publication Date: 2019.08.27 HANNSTAR DISPLAY CORP

AI summary

An electronic device package includes a substrate, an electronic device, and a first packaging layer. The electronic device and the first packaging layer are disposed on the substrate and the electronic device is located between the substrate and the first packaging layer. The first packaging layer includes a first oxynitride layer and a second oxynitride layer, wherein the second oxynitride layer is located between the first oxynitride layer and the electronic device. A composition of the first oxynitride layer includes SiNx1Oy1, a composition of the second oxynitride layer includes SiNx2Oy2, and x1>x2.