Oxynitride Phosphor Sintering Under High Nitrogen Pressure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for manufacturing oxynitride phosphors under normal pressure result in lower purity and reduced light intensity and thermal stability, while also being costly due to the use of nitride precursors, and lack effective methods for mass production.
Innovation Solution
Sintering a precursor under high nitrogen pressure (0.1-1000 MPa) to produce oxynitride phosphors with improved purity, light intensity, and thermal stability, using a combination of barium carbonate, silicon dioxide, silicon nitride, and europium oxide, and incorporating seed-mediated or acid washing processes to enhance properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If oxynitride phosphor is synthesized by sintering under normal pressure, then the manufacturing process is simpler, but the purity and light intensity are lower
Solution Approach 1:
The patent applies parameter changes by transitioning from normal pressure sintering to high pressure sintering (0.1-1000 MPa nitrogen pressure). This parameter change in the sintering process directly improves the purity and light intensity of the oxynitride phosphor while maintaining manufacturing feasibility through controlled pressure conditions
2Stability of the object's composition
If nitride precursors are used for synthesis, then the thermal stability improves, but the cost increases
Solution Approach 1:
The patent uses composite material strategy by combining nitride precursors (for thermal stability) with oxide precursors (for cost reduction). This composite approach allows the synthesis of oxynitride phosphor that maintains the thermal stability benefits of nitrides while reducing the overall cost through partial substitution with more economical oxide materials
3Illumination intensity
If high pressure sintering is applied, then the purity and light intensity increase, but the manufacturing complexity increases
Solution Approach 1:
The patent applies parameter changes by implementing high pressure sintering conditions (0.1-1000 MPa nitrogen pressure) which directly enhances the light intensity and purity of the phosphor product. The process complexity increase is managed through controlled parameter ranges and systematic process design
4Temperature
If oxynitride phosphor is synthesized under normal pressure, then the manufacturing is easier, but the thermal resistance is poor
Solution Approach 1:
The patent applies parameter changes by using high pressure sintering (0.1-1000 MPa nitrogen pressure) which improves the thermal resistance of the oxynitride phosphor. This parameter change in pressure conditions during synthesis enhances the material's thermal stability while maintaining manufacturing feasibility through controlled process conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves higher purity and increased light intensity and thermal resistance of oxynitride phosphors, enabling mass production with controlled particle size and improved performance.
Implementation Method 1
a precursor is sintered under high pressure for synthesis of an oxynitride phosphor
Implementation Method 2
sinter the precursor under 0.1-1000 MPa nitrogen pressure to get an oxynitride phosphor
Data Source
AI summary
A method of manufacturing an oxynitride phosphor is revealed. A precursor is sintered under 0.1-1000 MPa nitrogen pressure for synthesis of an oxynitride phosphor. The general formula of the oxynitride phosphors is Ba3-XSi6O12N2:EuxBa3-XSi6O6N6:Eux or Ba3-XSi6O9N4:Eux (0.00001≦x≦5; 0.00001). Thus pure phosphor can be mass-produced.