Ozone Water Radical Cleaning for Substrate Components
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Solution Overview
Problem
Current methods for cleaning components of substrate processing apparatuses, such as those used in semiconductor manufacturing, are inefficient in removing contaminants like carbon and fluorine deposits, often requiring harsh chemicals that can damage surfaces and generate significant waste, while also failing to completely remove fluorine contaminants.
Innovation Solution
A method and apparatus utilizing a cleaning solution with ozone water and UV light to generate hydrogen radicals and hydroxyl radicals for effectively removing carbon and fluorine contaminants from components, which are exposed to plasma during dry processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If harsh chemicals such as sulfuric acid or nitric acid are used for cleaning components, then the cleaning power is improved, but the component surface may be damaged and large amount of waste fluid is generated
Solution Approach 1:
The patent uses ozone water, a strong oxidizing agent, to generate radicals that effectively remove carbon and fluorine contaminants from components. The ozone decomposes to form highly reactive oxygen species that oxidize and remove organic contaminants without the need for harsh acids, thus maintaining cleaning efficiency while preventing surface damage.
Solution Approach 2:
The patent replaces the chemical mechanism (harsh acids) with a photochemical mechanism (UV light-induced radical generation). By using UV light to activate ozone water and generate radicals, the cleaning process achieves high effectiveness without the corrosive effects of strong acids, substituting a mechanical/physical process for a harmful chemical process.
2Productivity
If harsh chemicals such as sulfuric acid or nitric acid are used for cleaning components, then the cleaning power is improved, but large amount of waste fluid is generated requiring environment treatment
Solution Approach 1:
Ozone water serves as an eco-friendly strong oxidant that decomposes into oxygen after cleaning, leaving minimal waste. The oxidative action of ozone effectively removes contaminants while the byproduct is benign oxygen gas, eliminating the need for extensive waste fluid treatment required by acid-based cleaning methods.
Solution Approach 2:
The patent changes the chemical parameters of the cleaning solution by using ozone-saturated water instead of strong acids. This parameter change transforms the cleaning chemistry from one that produces hazardous waste to one that produces minimal, easily treatable waste, thereby reducing environmental impact and treatment costs.
3Device complexity
If conventional cleaning methods are used, then the process is simple, but fluorine contaminants are not completely removed
Solution Approach 1:
The patent replaces conventional chemical cleaning with a photochemical radical-based cleaning mechanism. UV light irradiation of ozone water generates highly reactive radicals that can effectively remove even tenaciously adhered fluorine contaminants, achieving complete removal while maintaining relatively simple process equipment.
Solution Approach 2:
Ozone water provides strong oxidative power through radical generation, enabling complete removal of fluorine contaminants that conventional cleaning methods cannot eliminate. The high reactivity of ozone-derived radicals ensures thorough contaminant removal without requiring excessively complex multi-step cleaning processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the efficiency of cleaning components by rapidly and completely removing contaminants, reducing surface damage and waste generation, and improving environmental and cost stability.
Implementation Method 1
generating radicals from the cleaning solution, and cleaning the component with the radicals. The cleaning solution may include ozone water, and the radicals may include hydrogen radicals (H2*) and hydroxyl radicals (OH*). The generating of the radicals may include emitting light toward the cleaning solution. The light may include UV light.
Implementation Method 2
generating radicals from the cleaning solution. The cleaning solution may include ozone water, and the radicals may include hydrogen radicals (H2*) and hydroxyl radicals (OH*).
Implementation Method 3
The radicals may remove a contaminant adhering to a surface of the component, and the contaminant may include carbon (C) and fluorine (F).
Data Source
AI summary
Disclosed are an apparatus and a method for cleaning a component of a substrate dry processing apparatus. The method for cleaning a component of a substrate dry processing apparatus includes dipping the component in a cleaning solution received in a cleaning bath, generating radicals from the cleaning solution, and cleaning the component with the radicals. The component is cleaned with hydrogen radicals (H2*) and hydroxyl radicals (OH*) generated from ozone water. Accordingly, it is possible to rapidly remove carbon (C) and fluorine (F) deposited on the component.