Package Structure Adhesion Enhancement for Bonding
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Solution Overview
Problem
Existing package structures face issues with adhesive application, where excessive adhesive can mar the appearance and insufficient adhesive can lead to detachment of the housing from the substrate, resulting in an unsatisfactory bonding effect.
Innovation Solution
Incorporating an adhesion enhancement structure with encircled or semi-encircled holes and a wall portion that directs adhesive to create an undercut, enhancing bonding between the housing and substrate while controlling adhesive distribution to prevent excess from reaching the chip module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive is applied too much, then bonding strength between housing and substrate is improved, but appearance of package structure is adversely affected
Solution Approach 1:
The adhesion enhancement structure introduces localized geometric features (encircled or semi-encircled holes) at specific positions on the housing, creating areas of concentrated adhesion enhancement without requiring excessive adhesive application across the entire bonding surface. This localized approach improves bonding strength while maintaining overall appearance quality.
2Shape
If adhesive is applied too little, then appearance of package structure is maintained, but housing may be detached from substrate (peeling)
Solution Approach 1:
The adhesion enhancement structure incorporates encircled or semi-encircled holes that function as porous or cavity features. These holes increase the effective bonding area and provide mechanical interlocking for the adhesive, enabling reliable bonding with reduced adhesive quantity while maintaining appearance quality.
3Shape
If adhesive is reduced to maintain appearance, then appearance quality is improved, but adhesion area is insufficient leading to peeling
Solution Approach 1:
The adhesion enhancement structure transitions from a two-dimensional flat bonding surface to a three-dimensional structure with encircled or semi-encircled holes. This dimensional change increases the effective adhesion area by creating additional bonding surfaces within the holes and along the walls, allowing sufficient adhesion with reduced adhesive quantity while maintaining appearance quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a robust bonding effect with increased adhesion area, reducing the risk of peeling and maintaining the package's appearance by optimizing adhesive application, even with less adhesive, and ensuring secure attachment at multiple points.
Implementation Method 1
The surrounding wall and the adhesion enhancement structure are bonded to the substrate by an adhesive
Data Source
AI summary
The invention provides a package structure which includes a substrate, at least one chip module, and a housing. The at least one chip module is located on the substrate. The housing includes an upper cover, a surrounding wall, and at least one adhesion enhancement structure. The surrounding wall is connected to the upper cover and encompasses the at least one chip module. The surrounding wall and the adhesion enhancement structure are bonded to the substrate by an adhesive. The adhesion enhancement structure includes an encircled hole or a semi-encircled hole.