Semiconductor Package Adhesive Groove Layout for Solder Joint Protection
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Solution Overview
Problem
Conventional semiconductor packaging processes face challenges in accurately controlling adhesive dispensing conditions, leading to excessive adhesive expansion, which can cause defects in solder joints and increase production costs due to requirements like cleaning, baking, and plasma treatment.
Innovation Solution
A package structure and method utilizing adhesive grooves and dummy bonding pads/cavities to control adhesive positions, shapes, and diameters, preventing adhesive overflow and reducing impact on solder joints, while allowing for heat dissipation through specific adhesive materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If adhesive is dispensed without controlled grooves or structures, then adhesive coverage area increases, but adhesive expansion becomes excessive and causes solder joint defects
Solution Approach 1:
The substrate surface is segmented into multiple adhesive grooves with specific patterns (e.g., linear, grid, or radial arrangements) that divide and confine the adhesive material. Each groove acts as an independent containment structure, preventing uncontrolled expansion while ensuring adequate adhesive distribution across the bonding area.
Solution Approach 2:
Different regions of the substrate are provided with adhesive grooves of varying dimensions, depths, and patterns according to local requirements. Areas requiring precise adhesive control have narrower grooves, while areas needing more adhesive have wider or deeper grooves, optimizing both position control and preventing harmful expansion.
2Reliability
If cleaning, baking, and plasma treatment processes are added to ensure complete filling, then adhesive bonding reliability improves, but production cost and process complexity increase
Solution Approach 1:
The substrate surface is pre-treated during manufacturing by forming adhesive grooves with surface characteristics (roughness, chemistry) that promote complete adhesive filling during dispensing. This preliminary structural preparation eliminates the need for subsequent cleaning, baking, or plasma treatment steps, as the groove design itself ensures proper adhesive wetting and filling.
Solution Approach 2:
The adhesive grooves are designed to automatically ensure complete filling through their geometric configuration (depth, width, taper angles) and surface properties, without requiring external intervention from additional processing steps. The structure itself performs the function of ensuring reliable bonding.
3Reliability
If adhesive grooves are positioned to control adhesive placement, then solder joint integrity improves, but manufacturing precision requirements increase
Solution Approach 1:
The adhesive grooves are segmented and positioned in specific patterns (e.g., peripheral, linear, or radial arrangements) that naturally guide adhesive flow away from critical solder joint areas. This segmentation allows for more relaxed positioning tolerances while still ensuring that adhesive does not encroach on solder balls or joints.
Solution Approach 2:
The adhesive grooves act as intermediary structures between the adhesive material and the solder joints, providing a controlled pathway for adhesive placement. The groove design (depth, width, orientation) mediates the interaction between adhesive expansion forces and solder joint protection requirements, reducing the precision demands on groove positioning.
4Reliability
If adhesive amount is increased to ensure complete filling, then bonding reliability improves, but adhesive expansion and impact on solder joints worsens
Solution Approach 1:
The adhesive grooves are designed with locally optimized dimensions (depth, width, length) and surface properties that control adhesive retention and expansion in different areas. Critical areas near solder joints have narrower or shallower grooves to limit adhesive presence, while non-critical areas have larger groove dimensions to accommodate more adhesive, achieving complete filling without overflow.
Solution Approach 2:
The adhesive dispensing area is segmented into multiple grooves that collectively hold the required adhesive amount. Each groove is sized to contain a specific portion of adhesive, preventing any single area from having excessive adhesive that could overflow and harm solder joints, while the total adhesive volume remains sufficient for reliable bonding.
Data Source
AI summary
A package structure and a method for fabricating the same are provided. The package structure includes a substrate, a semiconductor package and an adhesive body. The substrate has a first board surface and a second board surface. The semiconductor package has an upper surface and a lower surface, is disposed on the first board surface and electrically connected to the substrate through pins, and has a first vertical projection on the first board surface. An adhesive groove is disposed on the first board surface and is located in at least one portion of the first vertical projection and a periphery of the first vertical projection. The adhesive body is disposed in the adhesive groove, and protrudes to contact the lower surface, so as to fix the semiconductor package. The adhesive groove does not overlap with the pins, and the adhesive body does not contact the pins.