Semiconductor Package Structure With Spaced Adhesive for Heat Dissipation
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Solution Overview
Problem
The existing package structures face challenges with thermal resistance and delamination issues due to insufficient adhesion of thermal conductive layers and increased thermal resistance when using adhesive layers with higher adhesion abilities.
Innovation Solution
A package structure design that includes an electronic component, a heat dissipating element, and an adhesive layer with a specific configuration to reduce thermal resistance, where the adhesive layer is spaced apart from the electronic component to minimize the thermal conductive region occupied by the adhesive, and a thermal conductive layer is used to guide heat from the electronic component to the heat dissipating element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermal conductive layer is used to reduce thermal resistance between the electronic component and the heat dissipating element, then thermal resistance is reduced, but the adhesion ability is insufficient causing delamination
Solution Approach 1:
The patent introduces an adhesive layer as an intermediary between the thermal conductive layer and the heat dissipating element. This adhesive layer specifically addresses the adhesion deficiency of the thermal conductive layer by providing strong bonding to the heat dissipating element, while the thermal conductive layer maintains its thermal conductivity function. The two layers work together in a composite structure where each performs its specialized function without compromising the other.
Solution Approach 2:
The patent employs a composite structure consisting of both a thermal conductive layer and an adhesive layer stacked together. This composite approach allows the system to simultaneously achieve low thermal resistance (through the thermal conductive layer) and high adhesion strength (through the adhesive layer), resolving the contradiction by combining materials with complementary properties rather than relying on a single material to fulfill both functions.
2Reliability
If an adhesive layer with greater adhesion ability is used to prevent delamination, then adhesion ability is improved, but thermal resistance is increased degrading performance
Solution Approach 1:
The patent segments the functional requirements into two separate layers: the thermal conductive layer dedicated to heat conduction with minimal thickness to maintain low thermal resistance, and the adhesive layer dedicated to providing strong adhesion. This segmentation allows each layer to be optimized for its specific function without compromise, avoiding the need to use a thick adhesive layer that would increase thermal resistance.
Solution Approach 2:
The adhesive layer acts as an intermediary that specifically addresses the adhesion requirement without significantly impacting thermal performance. By positioning the adhesive layer between the thermal conductive layer and the heat dissipating element, it provides the necessary bonding strength while the thermal conductive layer remains the primary thermal pathway, minimizing the overall thermal resistance of the assembly.
3Temperature
If the adhesive layer is spaced apart from the electronic component to reduce thermal conductive region occupied by adhesive, then thermal resistance is reduced, but adhesion area is decreased
Solution Approach 1:
The patent resolves this contradiction by changing the spatial arrangement from a two-dimensional planar contact to a three-dimensional stacked configuration. The adhesive layer is positioned in the vertical dimension between the thermal conductive layer and the heat dissipating element, allowing the thermal conductive region to be minimized in the horizontal plane while the adhesive layer provides sufficient bonding area through its vertical positioning and lateral extent.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the reliability and yield of the package structure by reducing thermal resistance and preventing delamination, while maintaining adequate adhesion and thermal conductivity.
Implementation Method 1
The thermal conductive layer is disposed over the first portion of the encapsulant and abutting the lateral surface of the electronic component, and configured to guide a heat generated from the lateral surface of the electronic component to the heat dissipating element
Implementation Method 2
The adhesive layer is disposed between the electronic component and the heat dissipating element... the adhesion ability of the thermal conductive layer is not sufficient so that a delamination between the thermal conductive may occur
Data Source
AI summary
A package structure is provided. The package structure includes an electronic component, a heat dissipating element, and an adhesive layer. The heat dissipating element is disposed over the electronic component. The adhesive layer is disposed between the electronic component and the heat dissipating element and spaced apart from the electronic component by a first space. The first space is configured to reduce a thermal conductive region between the electronic component and the heat dissipating element occupied by the adhesive layer.