Semiconductor Package Adhesive Protection Layer
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Solution Overview
Problem
In the semiconductor industry, the formation of package structures for integrated circuits faces challenges such as exposure of adhesive layers during processing, which can lead to damage and residue formation, affecting the reliability of the device.
Innovation Solution
A method involving the formation of a protection layer over the edge of a carrier and an encapsulant layer that covers the adhesive layer, preventing exposure and damage during subsequent processes like polymer layer formation and redistribution layer formation, thereby ensuring the adhesive layer remains protected and intact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive layer is applied on carrier edge during package structure manufacturing, then die can be attached to carrier, but adhesive layer becomes exposed and vulnerable to damage during subsequent processing
Solution Approach 1:
A protection layer is formed over the carrier edge and adhesive layer before subsequent processing steps. This preliminary protective measure prevents the adhesive layer from being exposed to damage during polymer layer formation and redistribution layer formation, while still allowing the die to be properly attached to the carrier through the adhesive layer.
Solution Approach 2:
The protection layer acts as an intermediary element between the adhesive layer and the processing environment. It provides a protective barrier that shields the adhesive layer from mechanical damage and chemical exposure during manufacturing processes, while not interfering with the adhesive's bonding function.
2Ease of manufacture
If adhesive layer is exposed during processing, then subsequent layers can be formed, but seed layer residue forms and device reliability decreases
Solution Approach 1:
The protection layer is formed in advance to cover the adhesive layer before polymer layer and redistribution layer formation. This prevents the adhesive layer from being exposed to processing conditions that would cause seed layer residue formation, while still allowing subsequent layers to be formed over the protected structure.
Data Source
AI summary
A method of manufacturing a package structure includes the following processes. A carrier is provided. An adhesive layer is formed on the carrier. A die is attached to the carrier through the adhesive layer. An encapsulant is formed over the carrier to laterally encapsulate the die. A polymer material is formed over the carrier along a surface of the adhesive layer, a surface of the encapsulant and a top surface of the die. A first portion of the polymer material directly on an edge of the carrier has a first thickness larger than a second thickness of a second portion of the polymer material directly on the top surface of the die. A redistribution layer is formed to penetrate through the second portion of the polymer layer and electrically connect to the die.