Semiconductor Package Structure With Air Cavity Thermal Insulation
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Solution Overview
Problem
Current semiconductor package structures for oven-controlled crystal oscillators (OCXO) face challenges in maintaining constant temperature, leading to high manufacturing costs and increased power consumption due to the use of ceramic cavity substrates and insulating layers with high thermal conductivity, which do not effectively prevent heat loss.
Innovation Solution
The use of an organic substrate with an air or vacuum cavity as a heat conduction retardation zone, combined with insulators of low thermal conductivity, reduces heat loss and manufacturing costs while maintaining temperature stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If ceramic cavity substrates and insulating layers with high thermal conductivity are used, then temperature stability is maintained, but manufacturing costs increase and power consumption increases due to heat loss
Solution Approach 1:
The patent replaces expensive ceramic cavity substrates with organic substrates (such as printed circuit boards) that are cheaper and easier to manufacture. While ceramic materials provide good thermal stability, the invention achieves adequate temperature control for OCXO applications using lower-cost organic materials combined with strategic thermal insulation placement, reducing manufacturing costs while maintaining functional performance
Solution Approach 2:
The patent introduces thermal insulators (such as air gaps, foam materials, or low thermal conductivity substances) as intermediary elements between the oven structure and the external environment. These insulators mediate heat transfer by creating thermal resistance pathways, reducing heat loss to the surroundings while allowing the organic substrate to maintain its structural function, thereby addressing both cost reduction and energy conservation goals
2Temperature
If ceramic cavity substrates and insulating layers with high thermal conductivity are used, then temperature stability is maintained, but manufacturing costs increase
Solution Approach 1:
The patent replaces expensive ceramic cavity substrates with organic substrates (such as printed circuit boards) that are cheaper and easier to manufacture. While ceramic materials provide good thermal stability, the invention achieves adequate temperature control for OCXO applications using lower-cost organic materials combined with strategic thermal insulation placement, reducing manufacturing costs while maintaining functional performance
Solution Approach 2:
The patent changes the material parameter from ceramic to organic substrate, fundamentally altering the thermal and mechanical properties of the package structure. This material substitution enables the use of lower-cost manufacturing processes (such as standard PCB fabrication) while incorporating thermal insulators to compensate for the lower inherent thermal stability of organic materials, thus resolving the contradiction between cost and temperature stability
3Loss of energy
If insulators with low thermal conductivity are used, then heat loss is reduced and power consumption is reduced, but thermal insulation complexity increases
Solution Approach 1:
The patent introduces thermal insulators (such as air gaps, foam materials, or low thermal conductivity substances) as intermediary elements between the oven structure and the external environment. These insulators mediate heat transfer by creating thermal resistance pathways, reducing heat loss to the surroundings while maintaining a relatively simple overall structure that integrates well with the organic substrate approach
Solution Approach 2:
The patent employs thin film insulators or flexible insulation materials that can be easily applied to the oven structure without adding significant bulk or complexity. These thin film solutions provide effective thermal insulation while maintaining a compact and simple package design, avoiding the need for complex multi-layer insulation systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces heat loss and power consumption, enhancing the thermal insulation and reducing manufacturing costs, thereby improving the performance and efficiency of the OCXO.
Implementation Method 1
an air or vacuum cavity as a heat conduction retardation zone
Implementation Method 2
insulators of low thermal conductivity
Data Source
AI summary
The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.