Semiconductor Package Air Cavity Spacers for mmWave Antenna Stability
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Solution Overview
Problem
Millimeter wave signal attenuation and instability in high-frequency wireless transmission due to challenges in controlling the distance between substrates in semiconductor package devices, which affects antenna resonance and efficiency.
Innovation Solution
Incorporating spacers and adhesive layers between substrates to define a precise air cavity, ensuring consistent height and stability, and using materials with high melting points to maintain spacer integrity through the reflow process, thereby enhancing antenna patterns' gain, bandwidth, and radiation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If substrates are positioned close together for compact packaging, then device size is reduced, but distance control between substrates becomes difficult affecting antenna resonance
Solution Approach 1:
A spacer structure is introduced as an intermediary component between the first substrate and second substrate. The spacer includes a first portion attached to the first substrate and a second portion attached to the second substrate, physically mediating the gap between substrates and enabling precise distance control while maintaining compact overall device dimensions.
Solution Approach 2:
The spacer material is selected with specific physical properties including a melting point higher than the reflow process temperature. This parameter change ensures the spacer maintains its structural integrity and distance-defining function throughout the high-temperature reflow soldering process, enabling reliable substrate positioning.
2Reliability
If spacers are used to control substrate distance, then antenna resonance and efficiency are improved, but device complexity increases
Solution Approach 1:
The spacer is segmented into a first portion and a second portion, where the first portion attaches to the first substrate and the second portion attaches to the second substrate. This segmentation allows the spacer to be integrated with existing substrate structures without requiring a completely new complex component, thereby improving reliability while minimizing added complexity.
3Stability of the object's composition
If high melting point materials are used for spacers to maintain integrity through reflow, then spacer stability is improved, but manufacturing cost increases
Solution Approach 1:
The spacer material is selected with a melting point parameter higher than the reflow process temperature. This parameter change ensures the spacer maintains its dimensional stability and structural integrity throughout the high-temperature reflow soldering process, preventing deformation that would compromise antenna performance while using materials that are not excessively costly.
Data Source
AI summary
A semiconductor package device includes a first substrate, a second substrate and a first spacer. The first substrate includes a first divided pad. The second substrate includes a second divided pad disposed above the first divided pad. The first spacer is disposed between the first divided pad and the second divided pad. The first spacer is in contact with the first divided pad and the second divided pad.