Semiconductor Package Alignment Recess for Heat-Spreading Die Attach
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Solution Overview
Problem
As electronic devices are miniaturized, heat dissipation in semiconductor packages becomes a critical issue, and the arrangement of dies and connecting elements affects data transmission speed and reliability in multi-die packages.
Innovation Solution
A manufacturing process for semiconductor packages that includes a patternable die attach film, allowing for precise placement and attachment of semiconductor dies, followed by a heat spreader integration to enhance heat dissipation, and a redistribution structure for efficient electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional die attachment methods are used, then the manufacturing process is simple, but heat dissipation becomes insufficient as devices are miniaturized
Solution Approach 1:
The patent divides the die attachment process into multiple stages using a multi-layer structure: a first die attach film for initial attachment, and a second die attach film for reflow processing. This segmentation allows each layer to serve specific functions - the first layer provides initial mechanical bonding while the second layer enables thermal reflow for enhanced heat dissipation and strain relief, thereby resolving the contradiction between simple manufacturing and effective heat dissipation.
Solution Approach 2:
The patent introduces a vertical multi-layer die attach film structure that adds dimensional complexity to solve the heat dissipation problem. By stacking multiple die attach films with different material properties and processing temperatures, the solution moves from a single-plane attachment to a multi-dimensional thermal management architecture, enabling improved heat dissipation without fundamentally complicating the horizontal manufacturing flow.
2Reliability
If precise die placement is implemented, then data transmission speed and reliability improve, but manufacturing complexity increases
Solution Approach 1:
The patent applies preliminary action by first attaching dies using a first die attach film at a lower temperature to establish initial positioning and mechanical bonding. This preliminary attachment allows for subsequent reflow processing with the second die attach film to enhance reliability, without requiring perfect placement precision from the outset. The stepwise approach reduces the complexity burden while achieving high reliability through cumulative processing steps.
3Manufacturing precision
If die adhesive is removed after encapsulation, then manufacturing defects are reduced, but strain dispersal becomes challenging
Solution Approach 1:
The patent implements beforehand cushioning by designing the second die attach film to remain in place after the first die attach film is removed. This remaining second layer acts as a cushioning element that disperses strain during subsequent manufacturing steps, particularly during encapsulation and wire bonding processes. The pre-positioned second die attach film provides mechanical compliance that prevents defect formation without requiring complete adhesive removal, thereby maintaining both manufacturing precision and strain dispersal capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This process improves heat dissipation, reduces defects and manufacturing costs, and increases the yield of semiconductor packages by efficiently dispersing strain during die adhesive removal and simplifying the die placement process.
Implementation Method 1
a photo-crosslinkable die attach film including a photo-crosslinkable polymer and a photoinitiator
Implementation Method 2
heat spreader integration to enhance heat dissipation
Data Source
AI summary
A semiconductor package includes a die and an encapsulant. The die has an active surface and an opposite backside surface. The encapsulant wraps around the die and has a recess reaching the backside surface. A span of the recess differs from a span of the backside surface and a span of the encapsulant.