Semiconductor Package Backside Alignment Detection Using Shift Values
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Solution Overview
Problem
The increasing power consumption and complexity of miniaturized semiconductor packages pose challenges in determining their defectiveness, particularly in assessing the integrity of package substrates.
Innovation Solution
A method involving the measurement of shift values between window patterns and connection terminal arrays on the backside surface of a package substrate, using image processing techniques to determine if the substrate is defective by comparing these shift values with reference values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If miniaturization of semiconductor packages is pursued to meet electronic device size requirements, then the size and weight of semiconductor packages are reduced, but manufacturing precision and measurement accuracy become more difficult to maintain
Solution Approach 1:
The patent applies preliminary action by pre-defining reference values for shift values based on design specifications before actual manufacturing. During inspection, measured shift values are compared against these pre-established reference values to quickly determine compliance, enabling efficient quality control in miniaturized packages where manual measurement is impractical
Solution Approach 2:
The patent replaces complex mechanical measurement systems with automated image processing techniques. By capturing images of the backside surface and using algorithmic analysis to measure shift values between window patterns and connection terminal arrays, the system achieves high-precision measurement without complex mechanical contact probes, which is essential for miniaturized packages
2Reliability
If complex structures are added to semiconductor packages to increase capacity and performance, then functional capabilities are improved, but defect detection difficulty increases
Solution Approach 1:
The patent extracts and isolates specific critical features (window patterns and connection terminal arrays) from the complex package structure for focused inspection. By concentrating measurement efforts on these key elements and their relative positions rather than attempting to inspect every component, the method efficiently detects alignment defects in complex multi-array packages
Solution Approach 2:
The patent changes the inspection parameter from examining individual component integrity to measuring the relative positional relationship (shift value) between groups of features. This parameter transformation simplifies defect detection in complex structures by converting multiple potential defect points into a single measurable quantity that indicates overall alignment quality
3Ease of operation
If traditional inspection methods are used for package substrates, then inspection simplicity is maintained, but measurement accuracy deteriorates due to inability to capture subtle alignment deviations
Solution Approach 1:
The patent creates a digital copy (image) of the physical package substrate's backside surface and performs measurements on this replica. This allows multiple measurements and analyses without physically touching or potentially damaging the actual component, while enabling precise digital measurement of shift values that would be difficult to obtain with manual mechanical tools
Solution Approach 2:
The patent develops a multi-functional inspection system that combines image capture, automated feature recognition, shift value calculation, and compliance determination into a single integrated process. This universal approach handles various package configurations (different numbers of connection terminal arrays, different window pattern arrangements) using the same fundamental methodology, maintaining ease of operation while achieving high precision
Data Source
AI summary
A method of detecting a defective semiconductor package includes obtaining a target image of a backside surface of a package substrate that includes a pair of window patterns and connection terminal arrays extending in a first direction. A shift value of the pair of window patterns illustrated in the target image is measured, and the shift value is compared with a reference value to determine whether the package substrate is defective or is not defective. The measuring of the shift value of the pair of window patterns includes obtaining a first center position value between a pair of adjacent connection terminal arrays that are farthest away from each other among pairs of adjacent connection terminal arrays. A second center position value is obtained between the pair of window patterns. A difference between the first center position value and the second center position value is defined as the shift value.