Semiconductor Package Alignment Using Under Vision Correction
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Solution Overview
Problem
Misaligned semiconductor packages cause delays in manufacturing processes due to their inability to be correctly positioned on trays, leading to inefficiencies and potential damage during alignment attempts through vibration or manual methods.
Innovation Solution
A semiconductor manufacturing apparatus and method utilizing an inspector, under vision camera, and picker to detect and correct the alignment of semiconductor packages by calculating correction values for XY coordinates and rotation angles, allowing precise alignment without damaging other packages or halting the manufacturing flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If vibration method is used to align semiconductor packages, then alignment speed is improved, but damage to packages increases and alignment precision deteriorates
Solution Approach 1:
The patent replaces the mechanical vibration method with an automated picking and placing system. The picker precisely picks up misaligned packages and relocates them to correct positions based on inspection data, eliminating the need for violent vibration while achieving accurate alignment without package damage.
Solution Approach 2:
The system uses automated inspection to identify misaligned packages, then the picker automatically corrects their positions without human intervention. This self-correcting mechanism maintains precision while improving speed through automation rather than mechanical vibration.
2Reliability
If manual alignment method is used, then damage to packages is reduced, but productivity decreases and process time increases
Solution Approach 1:
The system performs automatic inspection and alignment correction without human intervention. The inspector detects misaligned packages and the picker automatically relocates them, maintaining package integrity through gentle handling while significantly improving productivity compared to manual methods.
Solution Approach 2:
The inspection data from the inspector provides feedback to the picker system, which then makes precise corrections to package positions. This closed-loop control ensures accurate alignment while maintaining package integrity, achieving both high reliability and productivity.
3Productivity
If misaligned packages are not corrected, then manufacturing flow continues uninterrupted, but process delays occur and quality deteriorates
Solution Approach 1:
The system performs inspection early in the process to identify misaligned packages before they cause downstream problems. The picker then corrects positions proactively, preventing process delays and quality issues while maintaining continuous manufacturing flow.
Solution Approach 2:
Real-time inspection data provides feedback that triggers automatic correction of misaligned packages. This ensures positioning accuracy is maintained throughout the manufacturing process without interrupting the overall production flow, as corrections are made immediately upon detection.
Data Source
AI summary
A semiconductor manufacturing apparatus includes a semiconductor package. A tray has the semiconductor package seated thereon. An inspector inspects an alignment state of the semiconductor package. A protrusion is on a top surface of the tray and extends in a Z direction that is a vertical direction. The protrusion surrounds a side surface of the semiconductor package when the semiconductor package is in an aligned state. The semiconductor package overlaps at least a portion of the protrusion in the Z direction when the semiconductor package is in a misaligned state. An under vision camera detects a rotation angle of the semiconductor package with respect to an X-Y plane defined in a first horizontal direction X and a second horizontal direction Y that cross the Z direction. A picker moves the semiconductor package between the tray and an area above the under vision camera.