Package Structure Alternating Protrusions Heat Dissipation
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Solution Overview
Problem
Flip chip packaging and clip bonding technologies face limitations in breakdown voltage and heat dissipation due to insufficient distance between the die and the carrier, and reduced heat dissipation effect of encapsulated copper clips, respectively.
Innovation Solution
A package structure featuring alternating protrusions of different polarities between the leadframe and the device, connected via a conductive unit, which increases the distance between the power component and the leadframe and includes an exposed conductive unit for enhanced heat dissipation, replacing conventional wire bonding and encapsulating materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If flip chip packaging is used to reduce parasitic inductance and improve signal density, then the interconnection length is reduced and signal inductance is greatly reduced, but the distance between the die and the carrier becomes insufficient, resulting in reduced breakdown voltage
Solution Approach 1:
The patent introduces an intermediary structure (insulating layer and spaced-apart electrodes) between the die and carrier that mediates the contradiction by providing electrical isolation while maintaining mechanical connection, thereby allowing reduced interconnection length for low inductance while ensuring sufficient breakdown voltage through the insulating barrier
Solution Approach 2:
The patent transitions from planar interconnection to three-dimensional structured electrodes with vertical spacing, creating multiple dimensions for electrical pathways. This allows the horizontal interconnection to remain short for low inductance while the vertical dimension provides the necessary insulation distance for high breakdown voltage
2Strength
If copper clip is used to connect the die to leadframe in clip bonding package, then the connection is made through solid copper bridge, but the heat dissipation effect is reduced due to encapsulation material
Solution Approach 1:
The patent segments the encapsulation structure by introducing gaps or voids between the encapsulation material and the copper clip, dividing the previously continuous encapsulating layer into separate regions. This segmentation allows heat to dissipate from the copper clip through multiple pathways while maintaining the mechanical protection and electrical insulation functions of the encapsulation material
Solution Approach 2:
The patent extracts or removes portions of the encapsulation material that would otherwise completely surround the copper clip, creating open spaces that allow heat to escape. This selective removal of encapsulation material preserves the connection strength while dramatically improving heat dissipation capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces parasitic inductance, improves breakdown voltage, and enables effective bi-directional heat dissipation, enhancing the reliability and performance of the package by increasing the distance between the power component and the leadframe and allowing for better heat management.
Implementation Method 1
The first portion of the conductive unit is connected to the substrate of the device. The second portion of the conductive unit is connected to the leadframe.
Implementation Method 2
The first protrusions are disposed on each of the first electrodes. The second protrusions are disposed on each of the second electrodes. The first protrusions and the second protrusions are connected to the leadframe.
Data Source
AI summary
A package structure is provided. The package structure includes a leadframe, a device, first protrusions, second protrusions, a conductive unit, and an encapsulation material. The device includes a substrate, an active layer, first electrodes, second electrodes and a third electrode. The first electrodes have different potentials than the second electrodes. The first electrodes and the second electrodes are arranged so that they alternate with each other. The first protrusions are disposed on each of the first electrodes. The second protrusions are disposed on each of the second electrodes. The first protrusions and the second protrusions are connected to the leadframe. The first side of the conductive unit is connected to the substrate of the device. The conductive unit is connected to the leadframe. The encapsulation material covers the device and the leadframe. The second side of the conductive unit is exposed from the encapsulation material.