Electronic Device Package Manufacturing via Anisotropic Etching
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for manufacturing electronic device packages face challenges in easily joining thin members due to deformation issues during through-hole formation, making it difficult to achieve further thickness reduction and reliable sealing.
Innovation Solution
The method involves joining a first member with a second member via internal electrodes, forming through holes in the second member, and placing conductive material within these holes to create external electrodes, allowing for easy connection and forming a depressurized sealed space using an annular metal wall portion, with the option to reduce the second member's thickness and use anisotropic etching for precise hole formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through holes are formed in the cover member before joining to the piezoelectric substrate, then the electronic device package can be sealed, but the cover member deforms making joining difficult
Solution Approach 1:
The patent applies preliminary action by forming through holes in the cover member before joining, but crucially performs thickness reduction of the cover member after joining. This sequence prevents deformation during joining while still achieving the necessary through holes for electrical connection and sealing.
Solution Approach 2:
The patent changes the thickness parameter of the cover member from its original state to a reduced state (not smaller than 25 μm and not greater than 90 μm) after joining. This parameter change enables easier formation of through holes and better sealing reliability without compromising the joining process.
2Length of moving object
If the thickness of the lid member or base member is reduced to achieve further thickness reduction in the electronic device package, then the package becomes thinner, but the members become more difficult to handle and join
Solution Approach 1:
The patent performs the joining operation before performing the thickness reduction operation. By joining the lid member and base member while they still have sufficient thickness for easy handling, then reducing the thickness of the lid member afterward, the patent achieves thin packaging without compromising the joining process.
Solution Approach 2:
The patent separates the manufacturing process into distinct stages: first joining the members at full thickness, then reducing the thickness of the lid member. This segmentation allows each operation to be optimized independently, achieving both ease of manufacture and thickness reduction.
3Reliability
If the cover member is joined to the piezoelectric substrate with through holes already formed, then sealing can be achieved, but the deformation from hole formation prevents easy joining
Solution Approach 1:
The patent performs thickness reduction after joining rather than before, which prevents deformation that would affect alignment precision during the joining process. The through holes are formed in the thinned cover member, ensuring precise alignment with internal electrodes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables easy joining of members, achieves reliable sealing, and allows for further thickness reduction of the electronic device package, ensuring the electronic device operates effectively by preventing air interference and external environmental influences.
Implementation Method 1
the through holes are formed by subjecting the second member to anisotropic etching
Data Source
AI summary
By joining a lid member to a base member, internal electrodes put in contact with the lid member and an electronic device connected to the internal electrodes are placed in an internal space located in between the base member and the lid member. By performing etching from a surface of the lid member on a side opposite from the base member by a prescribed method, through holes that reach the surface of the internal electrodes are formed. A conductive material is applied to the through holes, and external electrodes connected to the internal electrodes are formed in a plane, completing a thin type electronic device package.