3D Package Antenna Cavity for Compact Multi-Band RF Transmission
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Solution Overview
Problem
Conventional antennas in integrated circuits are limited in performance and capability due to the competing objective of size reduction in wireless applications, particularly in radio frequency devices.
Innovation Solution
The integration of vertical Through Insulator Via (TIV) plates and TIV gratings with high-k blocks embedded in the insulator between each TIV plate and grating forms an antenna oscillation cavity, allowing for high-frequency lateral RF transmission and enabling the transmission and reception of multiple RF bands.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional antennas are designed with size reduction, then the integrated circuit package size is reduced, but the antenna performance and capability deteriorate
Solution Approach 1:
The patent transitions from planar antenna designs to three-dimensional vertical structures by extending antenna elements through insulator layers via TIV plates and gratings. This vertical dimensionality enables enhanced radiation patterns and improved performance while maintaining compact footprint, directly resolving the contradiction between size reduction and performance maintenance.
Solution Approach 2:
The patent employs composite structures combining conductive materials (TIV plates and gratings) with high-k dielectric blocks embedded in insulator material. This composite approach creates antenna oscillation cavities that enhance electromagnetic field confinement and radiation efficiency, achieving superior performance in reduced package sizes.
2Volume of moving object
If conventional antennas are designed with size reduction, then the integrated circuit package size is reduced, but the RF transmission capability deteriorates
Solution Approach 1:
By extending antenna elements vertically through insulator layers using TIV technology, the patent creates three-dimensional radiation structures that enhance RF transmission capability. The vertical extension increases effective radiating area and improves impedance matching, enabling high-frequency lateral RF transmission in compact packages.
Solution Approach 2:
The patent modifies antenna structural parameters by varying the dimensions, spacing, and configuration of TIV plates and gratings. These parameter changes optimize resonance frequencies and radiation patterns for high-frequency applications, maintaining robust RF transmission capability despite reduced package size.
3Adaptability or versatility
If multiple RF bands are supported, then the antenna versatility is improved, but the antenna structure complexity increases
Solution Approach 1:
The patent designs TIV plate and grating structures that can operate across multiple RF bands by optimizing their geometric parameters. The same basic antenna structure supports different frequency ranges through parameter adjustment, achieving multi-band functionality without proportionally increasing structural complexity.
Solution Approach 2:
By adjusting the dimensions, spacing, and configuration parameters of TIV plates and gratings, the patent enables a single antenna structure to resonate at multiple frequencies. This parameter optimization approach allows one structure to serve multiple RF bands, improving versatility while controlling complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables high-frequency lateral RF transmission suitable for 5G & 6G applications, allows for the transmission and reception of up to eight different RF bands, and reduces the size of the integrated circuit package while maintaining manufacturing efficiency and reducing costs.
Implementation Method 1
a first high-k block embedded in the insulating material, wherein the first high-k block is disposed between the first conductive plate and the plurality of first conductive pillars, and wherein the first high-k block includes a material having a dielectric constant that is different than a dielectric constant of the insulating material
Data Source
AI summary
A package structure includes a first die, an insulating material around the first die, a first antenna extending through the insulating material, wherein the first antenna includes a first conductive plate extending through the insulating material and a plurality of first conductive pillars extending through the insulating material, wherein the first conductive plate is disposed between the plurality of first conductive pillars and the first die, and a first high-k block embedded in the insulating material, wherein the first high-k block is disposed between the first conductive plate and the plurality of first conductive pillars, and wherein the first high-k block comprises a material having a dielectric constant that is different than a dielectric constant of the insulating material.