Package Antenna Structure With Dielectric Tuning for RF Coupling Control
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in miniaturization and high-frequency applications, particularly in reducing the size of antenna structures while maintaining efficiency and preventing unwanted noise coupling in RF transceivers.
Innovation Solution
Incorporating a dielectric member with a higher dielectric constant than the molding material within the semiconductor structure, which resonates with the antenna and reduces coupling, allowing for tuning of resonant frequencies and improved reflection coefficients.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the antenna structure is miniaturized to reduce device size, then the physical footprint is reduced, but the antenna efficiency and resonant performance deteriorate
Solution Approach 1:
The patent introduces a dielectric member with a dielectric constant different from the molding material to change the electromagnetic parameters of the antenna system. This allows the miniaturized antenna to achieve proper resonant frequencies and maintain efficiency by adjusting the effective dielectric environment without increasing physical size
Solution Approach 2:
The dielectric member is positioned specifically beneath the antenna structure, creating a localized region with enhanced dielectric properties. This local modification of the electromagnetic environment improves the antenna's resonant performance and efficiency without affecting the overall device dimensions
2Adaptability or versatility
If multiple components with different materials are integrated for WLP applications, then functionality is enhanced, but unwanted noise coupling between components increases
Solution Approach 1:
The dielectric member acts as an intermediary element between the antenna structure and the substrate or other components. It provides electromagnetic isolation and reduces unwanted coupling and noise transmission between different parts of the integrated circuit while maintaining functional integration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances antenna efficiency in high-frequency applications, such as 5.8 GHz and 12 GHz RF transceivers, by optimizing the dielectric member's size and material to minimize noise interference and improve performance.
Implementation Method 1
a dielectric member extending through the molding, wherein the dielectric member has a second dielectric constant different from the first dielectric constant. The second redistribution structure includes an antenna over the dielectric member
Data Source
AI summary
A semiconductor structure includes a first redistribution structure, wherein the first redistribution structure includes first conductive pattern. The semiconductor structure further includes a die over the first redistribution structure. The semiconductor structure further includes a molding over the first redistribution structure, wherein the molding surrounds the die, and the molding has a first dielectric constant. The semiconductor structure further includes a dielectric member extending through the molding, wherein the dielectric member has a second dielectric constant different from the first dielectric constant. The semiconductor structure further includes a second redistribution structure over the die, the dielectric member and the molding, wherein the second redistribution layer includes an antenna over the dielectric member, and the antenna is electrically connected to the die.