Package Antenna Filter Integration for Millimeter-Wave Signal Purity
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Solution Overview
Problem
The integration and design of millimeter-wave frequency band filters in wireless communication systems face challenges due to their large size, which complicates the design and manufacturing of integrated circuit chips and terminals, especially when conventional 3G or 4G radio frequency front-end architectures are used.
Innovation Solution
A package antenna apparatus is introduced with a filter disposed on the package substrate, integrating an antenna array and a transceiver chip, where the filter filters signals between input and output ports, reducing the number of required filters and improving overall chip performance by placing the filter closer to the transceiver chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional 3G or 4G radio frequency front-end architecture is used with filters disposed on PCB, then filtering function is provided, but device size and manufacturing complexity increase significantly
Solution Approach 1:
The patent merges the filter with the package substrate to form an integrated structure. The filter is disposed on the package substrate and electrically connected to the transceiver chip, eliminating the need for separate PCB-mounted filters. This integration reduces the number of discrete components and simplifies the manufacturing process while maintaining the filtering function.
Solution Approach 2:
The package substrate serves multiple functions: it provides mechanical support for the transceiver chip, enables electrical connections through pads and conductors, and hosts the filter structure. This multi-functionality reduces the overall device complexity by consolidating multiple components into a single integrated platform.
2Object-affected harmful factors
If multiple filters are used for multichannel port transceiver chip, then frequency interference is reduced, but quantity of filters and device size increase
Solution Approach 1:
The patent segments the filtering function across multiple ports of the transceiver chip. Each port has its own filter structure disposed on the package substrate, allowing independent filtering of frequency interference for each channel. This segmentation approach provides effective interference reduction while optimizing the quantity of filters based on actual channel requirements.
Solution Approach 2:
The filter structures are locally optimized for each specific port and frequency band requirement. Different ports can have different filter characteristics tailored to their specific frequency ranges and interference profiles, providing targeted frequency interference reduction without requiring identical filters for all channels.
3Device complexity
If filter is disposed on package substrate, then package integration is improved, but design and manufacturing flexibility may be limited
Solution Approach 1:
The patent employs a flexible design where the filter structure on the package substrate can be adapted to different configurations. The filter may be implemented using various materials and construction methods (e.g., metal layers, dielectric layers, or attached filter components) depending on the specific application requirements, allowing dynamic adjustment of design parameters while maintaining integration benefits.
Data Source
AI summary
A package antenna apparatus including a package substrate, wherein an antenna array is disposed on the package substrate, and a transceiver chip coupled to the antenna array, where the transceiver chip is fastened to the package substrate, and the transceiver chip has a first pad and a second pad, and a filter disposed on the package substrate, where the filter comprises an input port and an output port, the input port is coupled to the first pad of the transceiver chip, the output port is coupled to the second pad of the transceiver chip, and the filter is configured to filter a signal of the transceiver chip that is input through the input port, and is further configured to output a filtered signal to the transceiver chip through the output port.