Semiconductor Package Antenna Layout for Directional Radiation Control
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Solution Overview
Problem
Conventional semiconductor device packages with antennas have limited flexibility in radiation direction due to components being parallel to the substrate surface, restricting the applicability and design of wireless communication devices.
Innovation Solution
The semiconductor device package includes a substrate with a reflector, a radiator, and a director, where the reflector, radiator, and director are positioned at different elevations, forming an angle greater than 0 degrees with the substrate surface, allowing for directional control of electromagnetic radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the antenna components (reflector, radiator, director) are disposed parallel to the substrate surface, then the manufacturing process is simple and the components are easy to fabricate, but the radiation direction is limited and the applicability of wireless communication devices is restricted
Solution Approach 1:
The patent applies dimensionality change by transitioning from a two-dimensional planar arrangement (all components parallel to substrate) to a three-dimensional spatial arrangement (components at different elevations). The reflector is disposed on the substrate surface, the radiator is elevated above the reflector, and the director is elevated above the radiator, creating a vertical stacking configuration that enables radiation in multiple directions including angles greater than 0 degrees relative to the substrate surface.
2Adaptability or versatility
If the antenna components are arranged at different elevations to achieve flexible radiation direction control, then the applicability and design freedom of wireless communication devices are enhanced, but the device structure becomes more complex
Solution Approach 1:
The patent implements nesting by vertically stacking the antenna components in a nested configuration where the radiator is positioned above and partially surrounding the reflector, and the director is positioned above and partially surrounding the radiator. This nested doll-like arrangement allows multiple components to occupy different vertical levels while maintaining a compact overall structure, achieving flexible radiation control without excessive horizontal space requirements.
Data Source
AI summary
A semiconductor device package includes a substrate, a reflector, a radiator and a first director. The reflector is disposed on a surface of the substrate. The radiator is disposed over the reflector. The first director is disposed over the radiator. The reflector, the radiator and the first director have different elevations with respect to the surface of the substrate. The radiator and the first director define an antenna.