Package-Integrated Antenna Structure for High-Frequency RF Assembly
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Solution Overview
Problem
The electronics industry faces challenges in designing antennas for higher frequency applications due to limited surface area on circuit boards and complex assembly processes, which increase costs and complexity.
Innovation Solution
A method for forming an antenna on a semiconductor device package involves a substrate with interconnect conductors, a protective coating, and conductors formed into specific patterns to create an antenna structure that includes a radiator and reflector plane, using materials like copper or gold, with an insulator to enhance radiation efficiency and impedance matching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple antennas are attached to the circuit board to meet higher frequency standards, then the frequency coverage is improved, but the assembly complexity and cost increase
Solution Approach 1:
The patent combines multiple antenna functions into a single integrated structure formed by conductive traces on the circuit board. Instead of attaching separate antenna components, the antenna pattern is created by routing conductive material in specific geometries that provide multiple frequency coverage, thereby reducing assembly complexity while maintaining frequency adaptability
Solution Approach 2:
The antenna structure is designed to perform multiple functions simultaneously - it provides impedance matching, radiation, and multiple frequency coverage through different resonant modes of the same conductive pattern. This multi-functional design eliminates the need for separate components for each function, reducing overall device complexity
2Adaptability or versatility
If multiple antennas are attached to the circuit board to meet higher frequency standards, then the frequency coverage is improved, but the cost increases
Solution Approach 1:
The patent merges multiple antenna functions into a single integrated structure formed by conductive traces on the circuit board. Instead of attaching separate antenna components, the antenna pattern is created by routing conductive material in specific geometries that provide multiple frequency coverage, thereby reducing assembly complexity while maintaining frequency adaptability
Solution Approach 2:
The antenna structure utilizes the circuit board's existing conductive traces and layout to create the antenna pattern, eliminating the need for separate antenna components and their associated assembly processes. The circuit board itself serves as the antenna substrate, reducing material and manufacturing costs
3Ease of operation
If the antenna is mounted on a flexible circuit board, then the antenna can be positioned next to electronic components, but the limited surface area restricts the antenna size
Solution Approach 1:
The patent transitions from planar antenna designs to three-dimensional antenna structures by utilizing vertical spacing between conductive layers. The antenna pattern extends in multiple dimensions, with conductive traces arranged in stacked configurations that provide additional radiation surfaces and increase effective antenna area without increasing the footprint on the circuit board
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides a more efficient use of space, simplifies assembly, and reduces costs by enabling the creation of effective antennas with improved radiation efficiency and impedance matching, suitable for higher frequency applications.
Implementation Method 1
a conductor 40 in a pattern of an antenna on the insulator 34. The conductor 40 is electrically connected to the second conductor 32 wherein the first semiconductor device is configured to apply an RF signal to the conductor 40
Implementation Method 2
forming an insulator 34 on at least a portion of the first conductor 31 and the second conductor 32
Implementation Method 3
The conductor 40 is electrically connected to the second conductor 32 wherein the first semiconductor device is configured to apply an RF signal to the conductor 40
Data Source
AI summary
In an embodiment, an antenna may be formed by applying an insulator to a package body and forming at least a portion of the antenna as a conductor on the insulator.