Package Structure Antenna Integration via Vertical Stacking
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in achieving compact, high-performance package structures for electronic devices, particularly in reducing the distance between antennas and ground planes while maintaining efficient electrical connections and minimizing footprint and height.
Innovation Solution
The method involves forming a first metallic pattern with antenna arrays on a carrier, followed by the creation of interlayer vias and a molding compound encapsulation, along with a redistribution structure that includes a reflector pattern and through vias, allowing for a compact package design with reduced height and enhanced electrical performance by integrating antennas directly above the die and connecting them through a redistribution layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If antennas are placed closer to the ground plane to reduce footprint, then the package size is reduced, but the electrical performance and gain deteriorate due to increased coupling and interference
Solution Approach 1:
The patent positions antennas in the vertical dimension above the die rather than lateral placement on the package surface. This vertical stacking approach reduces the horizontal footprint while maintaining adequate electrical separation from ground planes through the molding compound thickness, thus resolving the contradiction between compact size and electrical performance
Solution Approach 2:
The patent introduces a reflector pattern as an intermediary element between the antenna and ground plane. This reflector is configured to manage electromagnetic field distribution and reduce harmful coupling effects, allowing the antenna to be positioned closer to ground structures while maintaining electrical performance
2Length of stationary object
If the distance between antenna and ground plane is reduced to minimize package height, then the overall package height is reduced, but electrical connections and signal integrity are compromised
Solution Approach 1:
The patent utilizes vertical stacking to position antennas above the die in the Z-dimension, enabling compact package height while maintaining controlled electrical distances through precise molding compound thickness control. This dimensional reorganization allows height reduction without compromising signal integrity
Solution Approach 2:
The patent controls the thickness of the molding compound as a critical parameter to maintain optimal electrical distance between antennas and ground planes. By precisely controlling this dimensional parameter, the package achieves reduced height while preserving signal integrity through maintained electrical separation
3Reliability
If a complex redistribution structure with multiple layers is used to achieve compact routing, then the electrical connections are optimized, but the manufacturing complexity and process difficulty increase
Solution Approach 1:
The patent combines the reflector pattern and antenna support functions into a single integrated redistribution layer. This merging of functions reduces the number of separate redistribution layers needed, simplifying the overall structure while maintaining optimized electrical connections between antennas, die, and package externalities
Data Source
AI summary
A package structure comprising a die, a first molding compound encapsulating the die, an antenna structure and a reflector pattern disposed above the die is provided. Through vias penetrating through the first molding compound are disposed around the die. The reflector pattern is disposed on the die and the through vias. The antenna structure is disposed on the reflector pattern and electrically connected with the reflector pattern and the die. The antenna structure is wrapped by a second molding compound disposed on the reflector pattern.