3D Package Antenna Integration for Yield and Efficiency
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Solution Overview
Problem
Current semiconductor wafer level packaging technologies face challenges in efficiently integrating and testing 3D packaging and 3DIC devices, particularly in achieving high yield and reducing costs while ensuring reliable electrical connections and efficient electromagnetic wave coverage for antenna applications.
Innovation Solution
The method involves a multi-step process including the use of a debond layer, seed layer formation, conductive via creation, insulating encapsulation, redistribution layer formation, and integration of semiconductor dies, along with the formation of antenna elements that extend from one package to another, utilizing various materials like metals and polymers for electrical and mechanical connections, and optimizing the structure for antenna efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor devices are packaged at wafer level with other devices, then manufacturing efficiency is improved, but integration complexity and testing difficulty increase
Solution Approach 1:
The patent segments the packaging process into distinct stages: wafer-level preparation, individual die packaging, and final assembly. This allows high-volume wafer processing to maintain productivity while enabling controlled, systematic integration of multiple devices, reducing overall complexity through structured decomposition of the manufacturing workflow.
Solution Approach 2:
The patent transitions from planar wafer-level packaging to three-dimensional stacked packaging structures. By utilizing vertical stacking and multi-layer interconnections, the system achieves higher integration density while maintaining wafer-level manufacturing efficiency through automated bonding and alignment processes across multiple dimensional layers.
2Adaptability or versatility
If 3D packaging integration is enhanced, then device functionality is improved, but manufacturing cost and testing complexity increase
Solution Approach 1:
The patent performs preliminary testing and characterization of individual dies at the wafer level before packaging. This advance verification ensures that only functional dies are selected for 3D stacking, reducing rework and testing costs later. Additionally, standardization of interconnection interfaces is established in advance, simplifying subsequent assembly processes and reducing manufacturing variability.
Solution Approach 2:
The patent employs universal interconnection structures and standardized bonding interfaces that can accommodate different device types and configurations within the 3D stack. This multi-functional approach allows the same packaging infrastructure to support various device combinations, reducing per-unit manufacturing costs through economies of scale and standardized process flows.
3Adaptability or versatility
If antenna elements are integrated across multiple packages, then electromagnetic coverage is improved, but structural complexity and alignment precision requirements increase
Solution Approach 1:
The patent implements reference planes and ground structures that create equipotential regions across multiple packages, ensuring consistent electromagnetic performance. By establishing common reference potentials and standardized grounding schemes, the system achieves predictable electromagnetic behavior across distributed antenna elements without requiring ultra-precise alignment, as the equipotential structures compensate for minor positional variations.
Solution Approach 2:
The patent embeds antenna elements within the internal structure of packages rather than placing them only on external surfaces. This nested configuration allows antenna elements to be integrated into substrate layers and interconnection structures, providing three-dimensional electromagnetic coverage while reducing sensitivity to alignment errors, as the nested structures maintain their functional relationships through self-aligned fabrication processes.
Data Source
AI summary
A package structure includes a sub-package, a conductive structure, and at least one first antenna. The sub-package includes at least one chip. The conductive structure is bonded onto and electrically connected to the sub-package. The at least one first antenna has a vertical polarization and is electrically connected to the at least one chip, wherein the at least one first antenna is partially located in the sub-package, and the at least one first antenna is extended within the sub-package into the conductive structure.