Package Apparatus Dielectric Layer Binding Force
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Solution Overview
Problem
Conventional semiconductor package substrates face issues with insufficient binding force between molding compound layers and conductive pillars, leading to increased production costs and reliability concerns in BGA packaging due to poor solder mask resolution and film thickness uniformity.
Innovation Solution
A package apparatus and manufacturing method that replaces the conventional molding compound layer with a dielectric material layer formed by an additive layout process, eliminating the need for additional dielectric layers and solder resist layers, thereby improving binding force and reducing production complexity and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an additional dielectric material layer is formed to solve insufficient binding force between molding compound layer and conductive pillar layers, then binding force is improved, but fabrication process steps and production cost increase
Solution Approach 1:
The patent extracts and removes the additional dielectric material layer from the substrate structure. Instead of adding a separate dielectric layer between the molding compound layer and conductive pillar layers, the invention uses the molding compound layer itself as the dielectric material layer, thereby eliminating the need for the additional layer and reducing fabrication process steps while maintaining binding force requirements.
Solution Approach 2:
The patent applies multi-functionality by making the molding compound layer serve dual purposes: as the encapsulating molding compound and as the dielectric material layer. This eliminates the need for a separate dielectric layer, reducing both structural complexity and fabrication process steps while maintaining the necessary electrical insulation and mechanical binding functions.
2Reliability
If solder resist layer is disposed between dielectric material layer and third conductive pillar layer, then electrical insulation is improved, but film thickness uniformity and solder mask opens resolution deteriorate
Solution Approach 1:
The patent extracts and removes the solder resist layer from the substrate structure. By eliminating this layer, the invention avoids the manufacturing precision issues associated with film thickness uniformity and solder mask opens resolution, while electrical insulation is maintained through the dielectric material layer and molding compound layer design.
3Reliability
If multiple layers are formed in conventional substrate structure, then electrical insulation is improved, but material cost and device complexity increase
Solution Approach 1:
The patent applies multi-functionality by making existing layers serve multiple purposes. The molding compound layer functions both as the encapsulating material and as the dielectric material layer, eliminating the need for separate dielectric and solder resist layers. This reduces material cost and device complexity while maintaining necessary electrical insulation through optimized layer design and material selection.
Data Source
Figure 1~2
Figure 3A~3C
Figure 3D~3F
AI summary
A package apparatus comprises a first conductive wiring layer, a first conductive pillar layer, a dielectric material layer, a second conductive wiring layer, a second conductive pillar layer, and a first molding compound layer. The first conductive wiring layer has a first surface and a second surface opposite to the first surface. The first conductive pillar layer is disposed on the first surface of the first conductive wiring layer, wherein the first conductive wiring layer and the first conductive pillar layer are disposed inside the dielectric material layer. The second conductive wiring layer is disposed on the first conductive pillar layer and the dielectric material layer. The second conductive pillar layer is disposed on the second conductive wiring layer, wherein the second conductive wiring layer and the second conductive pillar layer are disposed inside the first molding compound layer.