Package Assembly Resonant Frequency Tuning via Lead Geometry
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Solution Overview
Problem
Electronic device packages often malfunction or fail when their natural resonant frequency aligns with the operating frequency of sensor elements, such as accelerometers, due to stress and vibration, as existing technologies do not effectively tune the resonant frequency to prevent such failures.
Innovation Solution
The package assembly incorporates a combination of leads with different geometrical shapes and positions, allowing for the adjustment of the natural resonant frequency by varying the lead shape, position, and number, thereby shifting the resonant frequency away from the sensor's operating frequency, using techniques like mirroring leads along symmetry planes and merging neighboring leads to create 'ribbon leads' for enhanced stiffness and rigidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the package uses a standard lead shape and pitch, then the manufacturing is simple and cost-effective, but the natural resonant frequency cannot be adjusted and may align with sensor operating frequency causing malfunction
Solution Approach 1:
The patent applies asymmetry by providing at least one first lead and one second lead with different geometrical shapes. The first lead has a first geometrical shape while the second lead has a second geometrical shape that is different from the first. This asymmetric lead configuration allows adjustment of the package's natural resonant frequency to prevent alignment with sensor operating frequency, thereby improving sensor reliability without requiring complete redesign of the entire lead structure.
Solution Approach 2:
The patent implements local quality by modifying only specific leads (at least one first lead and one second lead) with different geometrical shapes rather than changing the entire lead configuration. This localized modification approach allows resonant frequency tuning while maintaining standard lead structures for other leads, thus balancing reliability improvement with manufacturing simplicity.
2Strength
If the package increases rigidity through modified lead structures, then the natural resonant frequency increases, but the manufacturing complexity and production time increase
Solution Approach 1:
The patent applies merging by providing at least one first plurality of leads and one second plurality of leads, where each plurality contains multiple leads. By grouping leads into plurals and providing different geometrical shapes at the plurality level rather than individual lead level, the patent achieves rigidity enhancement while reducing the number of unique lead configurations that need to be manufactured, thereby maintaining manufacturing efficiency.
3Reliability
If the package uses multiple leads with different geometrical shapes and positions, then the natural resonant frequency can be tuned away from sensor operating frequency, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent implements universality by providing multiple plurals of leads (at least one first plurality and one second plurality) where each plurality can serve dual purposes: maintaining electrical connectivity functions and providing mechanical stiffness adjustment. The different geometrical shapes of leads within plurals allow resonant frequency tuning while the modular plurality structure enables standardized manufacturing processes, thus balancing reliability improvement with manufacturing ease.
Data Source
AI summary
A package assembly comprises an electronic device; a package body; at least a first plurality of leads having a first geometrical shape and a second plurality of leads having a second geometrical shape, protruding from the package body; each of the first plurality of leads being located in corners of the package body; or the first and the second plurality of leads arranged in at least a first row and a second row located in parallel to the first row; each of the rows comprising at least two leads; the first row being transformable into the second row by mirroring the first row along a symmetry plane of the package body; each of the first plurality of leads having the first geometrical shape different from the second geometrical shape.