Semiconductor Package Assembly for Large-Die Warpage Control
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving smaller and more efficient packaging techniques for semiconductor devices with advanced functionalities and reduced physical size, particularly in integrating ultra-large dies with minimal warpage and ensuring effective adhesive performance across large areas.
Innovation Solution
A manufacturing method involving a carrier with a release layer, encapsulating material, redistribution layer (RDL) structure, and heat dissipating feature, along with screw assemblies to secure the package, addressing warpage and adhesive performance issues in ultra-large dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If wafer level integration and packaging techniques are used to reduce physical size, then device footprint is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent divides the large die into multiple smaller dies that are arranged in an array on the carrier substrate. Each die can be processed and handled independently, reducing the complexity of manufacturing while achieving the same functional integration. The segmentation allows standard wafer-level processing techniques to be applied to smaller units that are then combined.
Solution Approach 2:
Multiple functional dies are integrated within a single package structure on the carrier substrate, creating a nested configuration where individual dies are embedded within the larger package assembly. This nesting approach enables high integration density while maintaining manageable manufacturing processes through modular assembly.
2Productivity
If ultra-large dies are used to reduce device count, then integration density improves, but warpage increases
Solution Approach 1:
Instead of using a single ultra-large die, the patent segments the functionality across multiple smaller dies arranged in an array. This segmentation inherently reduces warpage because each individual die experiences less thermal and mechanical stress, preventing the severe warpage that would occur with a single large die while maintaining high integration density.
Solution Approach 2:
The patent applies different properties to different regions of the package by using multiple dies with potentially different materials and structures optimized for their specific functions. Each die can be tailored with appropriate thermal expansion coefficients and mechanical properties to minimize local warpage, while the overall array achieves high integration density.
3Area of stationary object
If adhesive layers are applied over large areas to secure dies, then bonding coverage improves, but adhesive performance deteriorates
Solution Approach 1:
The patent divides the large bonding area into multiple smaller bonding regions, one for each individual die on the carrier substrate. Each die-sized adhesive layer maintains optimal thickness and curing characteristics, ensuring reliable adhesive performance. The segmented approach allows each local bonding area to perform optimally while collectively providing extensive total bonding coverage across the entire package.
Data Source
AI summary
A package includes a die having a first side and a second side opposite to each other. The package also includes an encapsulating material surrounding the die. The package further includes a redistribution layer (RDL) structure disposed over the first side of the die and the encapsulating material. The package yet includes a heat dissipating feature disposed over the second side of the die and the encapsulating material. In addition, the package includes a first screw assembly penetrating through the die, the RDL structure and the heat dissipating feature.