Semiconductor Package Barrier Structure Against Adhesive Bleed

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Solution Overview

Problem

The increasing size of semiconductor packages leads to a reduced space between passive devices and adhesive materials, risking contact and potential electrical or functional failure due to adhesive bleeding and tin whisker growth.

Innovation Solution

Incorporation of a barrier structure that separates passive devices from the lid structure and adhesive material, preventing adhesive spread and mitigating tin whisker growth.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the size of semiconductor packages is increased, then the functionality and integration are improved, but the space between passive devices and adhesive materials is reduced, leading to adhesive bleeding and potential contact

Engineering Contradiction:

ImprovefunctionalityVSAvoidadhesive contact risk

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent introduces a barrier structure that segments the package into distinct regions: a first region containing the passive device and a second region containing the adhesive material. This segmentation prevents the adhesive from contacting the passive device while allowing the package to maintain its functionality with increased size and integration.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The barrier structure acts as an intermediary element between the passive device and the adhesive material. It is disposed between these two components to prevent direct contact, thereby eliminating the harmful effect of adhesive bleeding while maintaining the benefits of larger package size and enhanced functionality.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Area of stationary object

If the space between passive devices and adhesive materials is reduced, then the package size is optimized, but adhesive bleeding may cause electrical or functional failure

Engineering Contradiction:

Improvepackage sizeVSAvoidelectrical failure risk

Core Design Contradiction:

Area of stationary objectVSReliability

Solution Approach 1:

By segmenting the package structure with a barrier, the patent allows for optimized package size with reduced spacing while preventing adhesive bleeding. The barrier creates distinct zones that maintain electrical isolation, thus enabling compact design without compromising reliability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The barrier structure serves as a mediator that enables closer spacing between passive devices and adhesive materials. It prevents direct contact and potential electrical failure while allowing the package to achieve optimized size, thus resolving the contradiction between compactness and reliability.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Area of stationary object

If the space between passive devices and lid structure is reduced, then the package compactness is improved, but tin whisker growth may contact the lid structure causing failure

Engineering Contradiction:

Improvepackage compactnessVSAvoidtin whisker contact risk

Core Design Contradiction:

Area of stationary objectVSReliability

Solution Approach 1:

The barrier structure segments the package to create a dedicated region for passive devices separated from the lid structure. This segmentation allows for reduced spacing and improved compactness while preventing tin whiskers from reaching the lid structure, thus maintaining reliability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The barrier acts as an intermediary protective layer between the passive device and the lid structure. It prevents tin whisker growth from contacting the lid structure while enabling closer spacing for improved package compactness, thereby resolving the contradiction between size and reliability.

Inventive Principle:

Principle #24Intermediary (Mediator)

4Reliability

If a barrier structure is added to separate passive devices from adhesive material, then the reliability is improved, but the device complexity increases

Engineering Contradiction:

Improveadhesive contact preventionVSAvoidstructure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The barrier structure is introduced as a simple intermediary element that provides reliable separation between passive devices and adhesive material. While it does increase structural complexity, the design is straightforward and can be integrated into existing package processes, making the complexity increase manageable for the significant reliability improvement.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS12519094B2Package structure and method of fabricating the same

Publication Date: 2026.01.06 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A package structure includes a circuit substrate, a semiconductor package, a lid structure, a passive device and a barrier structure. The semiconductor package is disposed on and electrically connected to the circuit substrate. The lid structure is disposed on the circuit substrate covering the semiconductor package. The lid structure is attached to the circuit substrate through an adhesive material. The passive device is disposed on the circuit substrate in between the semiconductor package and the lid structure. The barrier structure is separating the passive device from the lid structure and the adhesive material, and the barrier structure is in contact with the adhesive material.