Package Structure Barrier for Adhesive Isolation

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Solution Overview

Problem

The increasing size of semiconductor packages leads to a reduced enclosure width between passive devices and adhesive material, risking electrical and functional failures due to adhesive contact with passive devices and potential tin whisker interactions with the lid structure.

Innovation Solution

Incorporating a barrier structure that separates passive devices from the lid structure and adhesive material, preventing adhesive bleeding and tin whisker contact, while allowing for larger package sizes by maintaining a safe distance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the package size is increased, then the semiconductor package can accommodate more components and provide higher functionality, but the enclosure width between passive devices and adhesive material is reduced, increasing the risk of adhesive contact with passive devices and potential tin whisker interactions with the lid structure

Engineering Contradiction:

Improvepackage sizeVSAvoidrisk of adhesive contact with passive devices

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The patent introduces a barrier structure that segments the package into distinct regions: a first region containing passive devices and a second region containing the adhesive material. This segmentation prevents the adhesive from contacting the passive devices while allowing the overall package size to increase, thus resolving the contradiction between package volume and reliability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The barrier structure acts as an intermediary element between the passive devices and the adhesive material. It physically separates these two components, preventing direct contact and the associated reliability issues, while enabling the package to be scaled up in size without compromising the safety margin between adhesive and passive devices.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Volume of moving object

If the package size is increased, then more components can be integrated, but the enclosure width reduction increases the risk of tin whisker contact with the lid structure

Engineering Contradiction:

Improvepackage sizeVSAvoidtin whisker contact with lid structure

Core Design Contradiction:

Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The barrier structure segments the package space, creating a dedicated first region for passive devices (which may have tin whiskers) and a second region for the adhesive material near the lid structure. This segmentation ensures that tin whiskers from passive devices cannot contact the lid structure, even as the overall package size increases.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The barrier structure serves as an intermediary that physically isolates the passive devices (potential tin whisker source) from the lid structure. This intermediary barrier prevents the harmful interaction between tin whiskers and the lid structure, enabling package scaling without increasing the risk of tin whisker-related failures.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If a barrier structure is introduced to separate passive devices from adhesive material, then reliability is improved by preventing adhesive contact, but device complexity increases

Engineering Contradiction:

Improveprevention of adhesive contact with passive devicesVSAvoidpackage structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The barrier structure is designed to perform multiple functions simultaneously: it separates passive devices from adhesive material to prevent contact, provides mechanical support, and maintains the structural integrity of the package. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while achieving the reliability improvement.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The barrier structure is strategically placed only in the specific region where passive devices are located, rather than throughout the entire package. This localized approach provides the necessary separation and protection while minimizing the addition of structural complexity to the overall package design.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS11456287B2Package structure and method of fabricating the same

Publication Date: 2022.09.27 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A package structure includes a circuit substrate, a semiconductor package, a lid structure, a passive device and a barrier structure. The semiconductor package is disposed on and electrically connected to the circuit substrate. The lid structure is disposed on the circuit substrate covering the semiconductor package. The lid structure is attached to the circuit substrate through an adhesive material. The passive device is disposed on the circuit substrate in between the semiconductor package and the lid structure. The barrier structure is separating the passive device from the lid structure and the adhesive material, and the barrier structure is in contact with the adhesive material.