Semiconductor Package Circuit Board Structure for Adhesion and Fine Electrodes
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Solution Overview
Problem
The adhesion between connection members and package substrates or interposers in semiconductor packages is reduced due to the small surface roughness of electrodes, leading to potential peeling issues and reduced mechanical and electrical reliability.
Innovation Solution
A semiconductor package structure with an insulating layer and embedded connection member, featuring first and second connection electrodes, and electrode parts that overlap these electrodes vertically, along with a third electrode part that physically contacts the connection member, enhancing adhesion and rigidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the connection member is embedded in the package substrate and/or interposer, then the adhesion between the connection member and the package substrate and/or interposer is reduced, but the mechanical reliability and electrical reliability are improved
Solution Approach 1:
The patent applies different surface roughness characteristics to different regions of the electrodes. Specifically, the connection member electrodes are designed with smaller surface roughness to enable high-density electrode patterns and fine line widths, while the package substrate and interposer electrodes are designed with larger surface roughness to provide strong adhesion. This local differentiation allows each component to optimize its properties for its specific function without compromising the other.
2Strength
If the surface roughness of the electrodes is increased to improve adhesion, then the adhesion between connection member and package substrate is improved, but the line width and spacing of the electrodes cannot be refined
Solution Approach 1:
The patent implements local quality by assigning different surface roughness values to different electrode structures. The connection member electrodes have smaller surface roughness (Ra ≤ 0.8 μm) to achieve high-density patterns with fine line widths and tight spacing, while the package substrate and interposer electrodes have larger surface roughness (Ra ≥ 1.2 μm) to maximize adhesion strength. This spatial differentiation of surface properties resolves the contradiction between adhesion requirements and electrode refinement capabilities.
3Manufacturing precision
If the connection member has high-density electrodes with small surface roughness, then the line width and spacing of electrodes are refined, but the adhesion between connection member and package substrate is reduced
Solution Approach 1:
The patent resolves this contradiction by applying different surface roughness characteristics to different locations in the electrode system. The connection member, which requires high manufacturing precision for fine electrode patterns, is given smaller surface roughness. The package substrate and interposer, which require strong adhesion, are given larger surface roughness. This localized optimization allows each component to achieve its primary design goal without compromising the other.
Data Source
Figure 1a
Figure 1b~1c
Figure 1d~1e
AI summary
A circuit board according to an embodiment includes an insulating layer; a connection member embedded in the insulating layer; and an electrode part embedded in the insulating layer and overlapping the connection member in a vertical direction, wherein the connection member includes an electrode pattern disposed on the connection member, and the electrode pattern is electrically floated with the electrode part.